Bond Formation at Polycarbonate | X Interfaces (X = Al2O3, TiO2, TiAlO2) Studied by Theory and Experiments
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F24%3A00138697" target="_blank" >RIV/00216224:14310/24:00138697 - isvavai.cz</a>
Výsledek na webu
<a href="https://advanced.onlinelibrary.wiley.com/doi/full/10.1002/admi.202400340" target="_blank" >https://advanced.onlinelibrary.wiley.com/doi/full/10.1002/admi.202400340</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1002/admi.202400340" target="_blank" >10.1002/admi.202400340</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Bond Formation at Polycarbonate | X Interfaces (X = Al2O3, TiO2, TiAlO2) Studied by Theory and Experiments
Popis výsledku v původním jazyce
Interfacial bond formation during sputter deposition of metal-oxide thin films onto polycarbonate (PC) is investigated by ab initio molecular dynamics simulations and X-ray photoelectron spectroscopy (XPS) analysis of PC|X interfaces (X = Al2O3, TiO2, TiAlO2). Generally, the predicted bond formation is consistent with the experimental data. For all three interfaces, the majority of bonds identified by XPS are (C─O)─metal bonds, whereas C─metal bonds are the minority. Compared to the PC|Al2O3 interface, the PC|TiO2 and PC|TiAlO2 interfaces exhibit a reduction in the measured interfacial bond density by 75 and ∼65%, respectively. Multiplying the predicted bond strength with the corresponding experimentally determined interfacial bond density shows that Al2O3 exhibits the strongest interface with PC, while TiO2 and TiAlO2 exhibit ∼70 and ∼60% weaker interfaces, respectively. This can be understood by considering the complex interplay between the metal-oxide composition, the bond strength, and the population of bonds formed across the interface.
Název v anglickém jazyce
Bond Formation at Polycarbonate | X Interfaces (X = Al2O3, TiO2, TiAlO2) Studied by Theory and Experiments
Popis výsledku anglicky
Interfacial bond formation during sputter deposition of metal-oxide thin films onto polycarbonate (PC) is investigated by ab initio molecular dynamics simulations and X-ray photoelectron spectroscopy (XPS) analysis of PC|X interfaces (X = Al2O3, TiO2, TiAlO2). Generally, the predicted bond formation is consistent with the experimental data. For all three interfaces, the majority of bonds identified by XPS are (C─O)─metal bonds, whereas C─metal bonds are the minority. Compared to the PC|Al2O3 interface, the PC|TiO2 and PC|TiAlO2 interfaces exhibit a reduction in the measured interfacial bond density by 75 and ∼65%, respectively. Multiplying the predicted bond strength with the corresponding experimentally determined interfacial bond density shows that Al2O3 exhibits the strongest interface with PC, while TiO2 and TiAlO2 exhibit ∼70 and ∼60% weaker interfaces, respectively. This can be understood by considering the complex interplay between the metal-oxide composition, the bond strength, and the population of bonds formed across the interface.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
20506 - Coating and films
Návaznosti výsledku
Projekt
<a href="/cs/project/LM2023039" target="_blank" >LM2023039: Centrum výzkumu a vývoje plazmatu a nanotechnologických povrchových úprav</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2024
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Advanced Materials Interfaces
ISSN
2196-7350
e-ISSN
—
Svazek periodika
11
Číslo periodika v rámci svazku
30
Stát vydavatele periodika
US - Spojené státy americké
Počet stran výsledku
12
Strana od-do
1-12
Kód UT WoS článku
001271291200001
EID výsledku v databázi Scopus
2-s2.0-85198428399