Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F15%3APU114312" target="_blank" >RIV/00216305:26210/15:PU114312 - isvavai.cz</a>

Výsledek na webu

<a href="http://mit.imt.si/Revija/izvodi/mit152/kvapil.pdf" target="_blank" >http://mit.imt.si/Revija/izvodi/mit152/kvapil.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.17222/mit.2013.238" target="_blank" >10.17222/mit.2013.238</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements

Popis výsledku v původním jazyce

Thermal contact conductance is an important parameter for describing the heat transfer between two bodies. When two solids are put in contact and heat transfer occurs, a temperature drop is observed at the interface between the solids. This is caused by an imperfect joint, which occurs because the real surfaces are not perfectly smooth and flat. This paper describes an experimental device for the evaluation of the thermal contact conductance, which was designed and fabricated in the Heat Transfer and Fluid Flow Laboratory. This device was built mainly for simulating metal-forming conditions, which include high pressures (up to 360 MPa) and high temperatures (up to 1200 degC) in the contact of two solids. The principle of this investigation is the unsteady measurement of the temperatures of two solids that are put in contact under different conditions. The surface temperature and thermal contact conductance can be calculated from the measured temperatures by an inverse heat-transfer task. The measured temperature history and the calculated values of the thermal contact conductance for pilot tests are presented in this paper.

Název v anglickém jazyce

Estimation of the Thermal Contact Conductance From Unsteady Temperature Measurements

Popis výsledku anglicky

Thermal contact conductance is an important parameter for describing the heat transfer between two bodies. When two solids are put in contact and heat transfer occurs, a temperature drop is observed at the interface between the solids. This is caused by an imperfect joint, which occurs because the real surfaces are not perfectly smooth and flat. This paper describes an experimental device for the evaluation of the thermal contact conductance, which was designed and fabricated in the Heat Transfer and Fluid Flow Laboratory. This device was built mainly for simulating metal-forming conditions, which include high pressures (up to 360 MPa) and high temperatures (up to 1200 degC) in the contact of two solids. The principle of this investigation is the unsteady measurement of the temperatures of two solids that are put in contact under different conditions. The surface temperature and thermal contact conductance can be calculated from the measured temperatures by an inverse heat-transfer task. The measured temperature history and the calculated values of the thermal contact conductance for pilot tests are presented in this paper.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20303 - Thermodynamics

Projekt

<a href="/cs/project/EE2.3.20.0188" target="_blank" >EE2.3.20.0188: Multidisciplinární tým pro výzkum a aplikace tepelných procesů</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Materiali in tehnologije

ISSN

1580-2949

e-ISSN

1580-3414

Svazek periodika

49

Číslo periodika v rámci svazku

2

Stát vydavatele periodika

SI - Slovinská republika

Počet stran výsledku

4

Strana od-do

219-222

Kód UT WoS článku

000353936700008

EID výsledku v databázi Scopus

2-s2.0-84929737519