Hydrometallurgical Methods for Extracting Non-ferrous Metals from Electronic Gadgets

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F21%3APU143869" target="_blank" >RIV/00216305:26210/21:PU143869 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.cetjournal.it/cet/21/88/023.pdf" target="_blank" >http://www.cetjournal.it/cet/21/88/023.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3303/CET2188023" target="_blank" >10.3303/CET2188023</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Hydrometallurgical Methods for Extracting Non-ferrous Metals from Electronic Gadgets

Popis výsledku v původním jazyce

This article explores an environmentally friendly method of complex processing of printed circuit boards of cell phones in order to extract gold and other valuable components without cyanides. Thiourea was used as reagents for leaching gold and silver. A nitric acid-based solder solvent was used to separate the electronic components and gold plating from the printed circuit boards. To eliminate the harmful effect of copper on thiourea, the printed circuit boards were not crushed at the gold recovery stage. As a result, Ag 51 % and Au 89 % were extracted at t = 60 °C and a thiourea concentration of 12 g/L. The presented method is environmentally friendly in comparison with cyanide methods of gold recovery and effective in terms of the amount of gold recovery. © 2021, AIDIC Servizi S.r.l.

Název v anglickém jazyce

Hydrometallurgical Methods for Extracting Non-ferrous Metals from Electronic Gadgets

Popis výsledku anglicky

This article explores an environmentally friendly method of complex processing of printed circuit boards of cell phones in order to extract gold and other valuable components without cyanides. Thiourea was used as reagents for leaching gold and silver. A nitric acid-based solder solvent was used to separate the electronic components and gold plating from the printed circuit boards. To eliminate the harmful effect of copper on thiourea, the printed circuit boards were not crushed at the gold recovery stage. As a result, Ag 51 % and Au 89 % were extracted at t = 60 °C and a thiourea concentration of 12 g/L. The presented method is environmentally friendly in comparison with cyanide methods of gold recovery and effective in terms of the amount of gold recovery. © 2021, AIDIC Servizi S.r.l.

Druh

J_SC - Článek v periodiku v databázi SCOPUS

CEP obor

—

OECD FORD obor

20704 - Energy and fuels

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Chemical Engineering Transactions

ISSN

2283-9216

e-ISSN

—

Svazek periodika

neuveden

Číslo periodika v rámci svazku

88

Stát vydavatele periodika

IT - Italská republika

Počet stran výsledku

6

Strana od-do

139-144

Kód UT WoS článku

—

EID výsledku v databázi Scopus

2-s2.0-85122562825