Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F23%3APU149076" target="_blank" >RIV/00216305:26210/23:PU149076 - isvavai.cz</a>

Výsledek na webu

<a href="https://iopscience.iop.org/article/10.1149/1945-7111/ace133" target="_blank" >https://iopscience.iop.org/article/10.1149/1945-7111/ace133</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1149/1945-7111/ace133" target="_blank" >10.1149/1945-7111/ace133</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

Popis výsledku v původním jazyce

A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.

Název v anglickém jazyce

Transient Simulation of Diffusion-Limited Electrodeposition Using Volume of Fluid (VOF) Method

Popis výsledku anglicky

A numerical model utilizing the volume of fluid (VOF) method is proposed to simulate the transient shape changes of the deposit front, considering the diffusion-limited electrodeposition process. Modeling equations are proposed to accurately handle transport phenomena in both electrolyte (fluid) and deposit (solid). Transient evolutions of field structures, including flow, concentration, electric current density, and electric potential, are computed considering electrodeposited copper bumps. Two cases, including single cavity and multiple cavities, are studied. Based on the modeling results, the maximum height of the hump and the thickness of the deposited layer in each consecutive cavity decreases going from upstream to downstream. Conversely, the location of the maximum height of the hump remains unchanged in all cavities. Results are validated against available experiments.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

10405 - Electrochemistry (dry cells, batteries, fuel cells, corrosion metals, electrolysis)

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

JOURNAL OF THE ELECTROCHEMICAL SOCIETY

ISSN

0013-4651

e-ISSN

1945-7111

Svazek periodika

170

Číslo periodika v rámci svazku

7

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

6

Strana od-do

1-6

Kód UT WoS článku

001021994100001

EID výsledku v databázi Scopus

2-s2.0-85164283271