QCONCEPT OF SMART CYMBAL STRUCTURE FOR STRUCTURAL HEALTH MONITORING APPLICATIONS
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26210%2F24%3APU155224" target="_blank" >RIV/00216305:26210/24:PU155224 - isvavai.cz</a>
Výsledek na webu
<a href="https://www.engmech.cz/im/proceedings/show_p/2024/262" target="_blank" >https://www.engmech.cz/im/proceedings/show_p/2024/262</a>
DOI - Digital Object Identifier
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Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
QCONCEPT OF SMART CYMBAL STRUCTURE FOR STRUCTURAL HEALTH MONITORING APPLICATIONS
Popis výsledku v původním jazyce
The area of embedded sensors, adaptronics, smart material and smart structures has a key role in Structural Health Monitoring. The aim of embedding smart materials into engineering structures is to monitor a wide variety of material’s properties and enabling continuous or permanent measurements of their structural integrity. The integration of sensors into the structure is limited to processing technology used for embedding sensors and the possibility to damage the structure during insertion. This study focuses on developing sensory structure with force to voltage amplifying capabilities. The base unit and periodic concept of such structure is developed, and FEM model of base unit is done to observe basic behavior under load. Experiments with base unit for its voltage response were carried out on a prototype. Furthermore, a three base unit sample is created and a concept of a planar three-layer structure is developed.
Název v anglickém jazyce
QCONCEPT OF SMART CYMBAL STRUCTURE FOR STRUCTURAL HEALTH MONITORING APPLICATIONS
Popis výsledku anglicky
The area of embedded sensors, adaptronics, smart material and smart structures has a key role in Structural Health Monitoring. The aim of embedding smart materials into engineering structures is to monitor a wide variety of material’s properties and enabling continuous or permanent measurements of their structural integrity. The integration of sensors into the structure is limited to processing technology used for embedding sensors and the possibility to damage the structure during insertion. This study focuses on developing sensory structure with force to voltage amplifying capabilities. The base unit and periodic concept of such structure is developed, and FEM model of base unit is done to observe basic behavior under load. Experiments with base unit for its voltage response were carried out on a prototype. Furthermore, a three base unit sample is created and a concept of a planar three-layer structure is developed.
Klasifikace
Druh
O - Ostatní výsledky
CEP obor
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OECD FORD obor
20301 - Mechanical engineering
Návaznosti výsledku
Projekt
<a href="/cs/project/GC22-14387J" target="_blank" >GC22-14387J: Návrh a výroba 4D metamateriálů založených na tištěných strukturách s integrovanými prvky ze smart materiálů</a><br>
Návaznosti
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Ostatní
Rok uplatnění
2024
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů