A chip based on microelectrode arrays for the fabrication of single nanowire system via dielectrophoresis effect

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU121283" target="_blank" >RIV/00216305:26220/16:PU121283 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

A chip based on microelectrode arrays for the fabrication of single nanowire system via dielectrophoresis effect

Popis výsledku v původním jazyce

We develop a chip based on microelectrode arrays to be used in the fabrication of single nanowire (NW) systems for gas detection. The proposed topology of test electrode system was designed to understand the different factor involved in the dielectrophoresis (DEP) process and determine the optimal conditions for a facile integration and alignment of semiconducting metal oxide NWs produced via aerosol-assisted chemical vapor deposition (AACVD). Various electrode geometries with electrode gaps between 2 and 10 µm and electrode tip-end shapes are investigated. Results obtained from SEM, optical microscopy and electrical measurement demonstrate the integration and alignment of single NW across the electrodes only for the electrodes with gaps below 3 µm. These results are discussed and further improvements in the design of these systems are suggested.

Název v anglickém jazyce

A chip based on microelectrode arrays for the fabrication of single nanowire system via dielectrophoresis effect

Popis výsledku anglicky

We develop a chip based on microelectrode arrays to be used in the fabrication of single nanowire (NW) systems for gas detection. The proposed topology of test electrode system was designed to understand the different factor involved in the dielectrophoresis (DEP) process and determine the optimal conditions for a facile integration and alignment of semiconducting metal oxide NWs produced via aerosol-assisted chemical vapor deposition (AACVD). Various electrode geometries with electrode gaps between 2 and 10 µm and electrode tip-end shapes are investigated. Results obtained from SEM, optical microscopy and electrical measurement demonstrate the integration and alignment of single NW across the electrodes only for the electrodes with gaps below 3 µm. These results are discussed and further improvements in the design of these systems are suggested.

Druh

D - Stať ve sborníku

CEP obor

JB - Senzory, čidla, měření a regulace

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

IMAPS Flash Conference 2nd International Microelectronics Assembly and Packaging Society Flash Conference

ISBN

978-80-214-5416-3

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IMAPS

Místo vydání

Brno

Místo konání akce

Brno

Datum konání akce

3. 11. 2016

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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