Advanced mid-infrared plasmonic waveguides for on-chip integrated photonics

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F23%3APU150805" target="_blank" >RIV/00216305:26620/23:PU150805 - isvavai.cz</a>

Výsledek na webu

<a href="https://opg.optica.org/prj/fulltext.cfm?uri=prj-11-10-1694&id=540366" target="_blank" >https://opg.optica.org/prj/fulltext.cfm?uri=prj-11-10-1694&id=540366</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1364/PRJ.495729" target="_blank" >10.1364/PRJ.495729</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Advanced mid-infrared plasmonic waveguides for on-chip integrated photonics

Popis výsledku v původním jazyce

Long-wave infrared (LWIR, 8–14 μm) photonics is a rapidly growing research field within the mid-IR with applications in molecular spectroscopy and optical free-space communication. LWIR applications are often addressed using rather bulky tabletop-sized free-space optical systems, preventing advanced photonic applications, such as rapid-time-scale experiments. Here, device miniaturization into photonic integrated circuits (PICs) with maintained optical capabilities is key to revolutionize mid-IR photonics. Subwavelength mode confinement in plasmonic structures enabled such miniaturization approaches in the visible-to-near-IR spectral range. However, adopting plasmonics for the LWIR needs suitable low-loss and -dispersion materials with compatible integration strategies to existing mid-IR technology. In this paper, we further unlock the field of LWIR/mid-IR PICs by combining photolithographic patterning of organic polymers with dielectric-loaded surface plasmon polariton (DLSPP) waveguides. In particular, polyethylene shows favorable optical properties, including low refractive index and broad transparency between ∼2 μm and 200 μm. We investigate the whole value chain, including design, fabrication, and characterization of polyethylene-based DLSPP waveguides and demonstrate their first-time plasmonic operation and mode guiding capabilities along S-bend structures. Low bending losses of ∼1.3 dB and straight-section propagation lengths of ∼1 mm, pave the way for unprecedented complex on-chip mid-IR photonic devices. Moreover, DLSPPs allow full control of the mode parameters (propagation length and guiding capabilities) for precisely addressing advanced sensing and telecommunication applications with chip-scale devices.

Název v anglickém jazyce

Advanced mid-infrared plasmonic waveguides for on-chip integrated photonics

Popis výsledku anglicky

Long-wave infrared (LWIR, 8–14 μm) photonics is a rapidly growing research field within the mid-IR with applications in molecular spectroscopy and optical free-space communication. LWIR applications are often addressed using rather bulky tabletop-sized free-space optical systems, preventing advanced photonic applications, such as rapid-time-scale experiments. Here, device miniaturization into photonic integrated circuits (PICs) with maintained optical capabilities is key to revolutionize mid-IR photonics. Subwavelength mode confinement in plasmonic structures enabled such miniaturization approaches in the visible-to-near-IR spectral range. However, adopting plasmonics for the LWIR needs suitable low-loss and -dispersion materials with compatible integration strategies to existing mid-IR technology. In this paper, we further unlock the field of LWIR/mid-IR PICs by combining photolithographic patterning of organic polymers with dielectric-loaded surface plasmon polariton (DLSPP) waveguides. In particular, polyethylene shows favorable optical properties, including low refractive index and broad transparency between ∼2 μm and 200 μm. We investigate the whole value chain, including design, fabrication, and characterization of polyethylene-based DLSPP waveguides and demonstrate their first-time plasmonic operation and mode guiding capabilities along S-bend structures. Low bending losses of ∼1.3 dB and straight-section propagation lengths of ∼1 mm, pave the way for unprecedented complex on-chip mid-IR photonic devices. Moreover, DLSPPs allow full control of the mode parameters (propagation length and guiding capabilities) for precisely addressing advanced sensing and telecommunication applications with chip-scale devices.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

10306 - Optics (including laser optics and quantum optics)

Projekt

<a href="/cs/project/LM2018110" target="_blank" >LM2018110: Výzkumná infrastruktura CzechNanoLab</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Photonics Research

ISSN

2327-9125

e-ISSN

—

Svazek periodika

11

Číslo periodika v rámci svazku

10

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

9

Strana od-do

1694-1702

Kód UT WoS článku

001108685800010

EID výsledku v databázi Scopus

2-s2.0-85173908585