Optimalizace vytvrzovacích procesů izolací na bázi epoxidů

Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F08%3A00500449" target="_blank" >RIV/49777513:23220/08:00500449 - isvavai.cz</a>
Výsledek na webu
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DOI - Digital Object Identifier
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Jazyk výsledku
angličtina
Název v původním jazyce
Optimalization of the thermal curing of epoxy based insulation
Popis výsledku v původním jazyce
There is difficult to imagine modern production of electrical devices without components containing organic substances. This fact is mainly concerned to composite materials, in which the bond component is made of organic substance. The intricate curing reactions have been proceeding during the composites technological curing as well as during the device operation, where mostly the thermal-oxidative reactions, leading to material degradation, occur. For above-mentioned reasons, there is given big attention to the study of the reactions proceeding in the material.
Název v anglickém jazyce
Optimalization of the thermal curing of epoxy based insulation
Popis výsledku anglicky
There is difficult to imagine modern production of electrical devices without components containing organic substances. This fact is mainly concerned to composite materials, in which the bond component is made of organic substance. The intricate curing reactions have been proceeding during the composites technological curing as well as during the device operation, where mostly the thermal-oxidative reactions, leading to material degradation, occur. For above-mentioned reasons, there is given big attention to the study of the reactions proceeding in the material.

Druh
J<sub>x</sub> - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
CEP obor
JA - Elektronika a optoelektronika, elektrotechnika
OECD FORD obor
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Rok uplatnění
2008
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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