Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F09%3A00501558" target="_blank" >RIV/49777513:23220/09:00501558 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate

Popis výsledku v původním jazyce

An influence of accelerated thermal treatment of thermosetting epoxy laminate on its glass transition temperature was studied. Lamplex? FR-4 glass fibre einforced epoxy laminate (used for printed circuit boards manufacturing) was used for the purpose ofthe experiment. Composite was exposed to thermal treatment at the temperatures from 170 to 200 °C for the time of 10 ? 480 hours. Glass transition (Tg) was analyzed via dynamic mechanical analysis (DMA). It has been proved that glass transition temperature rapidly decreases in reaction to thermal stress. Obtained Tg data were used for Arrhenius plots for different critical temperatures (Tg-crit. = 105 ?120 °C). From their slopes (-Ea/R) the activation energy of the thermal degradation process was calculated as 75,5 kJ/mol. DMA recorded besides this main relaxation mechanism also one smaller relaxation process in the most aged samples. Microscopic analysis of sample?s structure showed the presence of expressive germs of degradation both

Název v anglickém jazyce

Influence of thermal treatment on glass transition temperature of thermosetting epoxy laminate

Popis výsledku anglicky

An influence of accelerated thermal treatment of thermosetting epoxy laminate on its glass transition temperature was studied. Lamplex? FR-4 glass fibre einforced epoxy laminate (used for printed circuit boards manufacturing) was used for the purpose ofthe experiment. Composite was exposed to thermal treatment at the temperatures from 170 to 200 °C for the time of 10 ? 480 hours. Glass transition (Tg) was analyzed via dynamic mechanical analysis (DMA). It has been proved that glass transition temperature rapidly decreases in reaction to thermal stress. Obtained Tg data were used for Arrhenius plots for different critical temperatures (Tg-crit. = 105 ?120 °C). From their slopes (-Ea/R) the activation energy of the thermal degradation process was calculated as 75,5 kJ/mol. DMA recorded besides this main relaxation mechanism also one smaller relaxation process in the most aged samples. Microscopic analysis of sample?s structure showed the presence of expressive germs of degradation both

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Polymer Testing

ISSN

0142-9418

e-ISSN

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Svazek periodika

28

Číslo periodika v rámci svazku

4

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

9

Strana od-do

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Kód UT WoS článku

000266856700010

EID výsledku v databázi Scopus

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