SU-8 microchannels for live cell dielectrophoresis improvements

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43925715" target="_blank" >RIV/49777513:23220/15:43925715 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/49777513:23520/15:43925715

Výsledek na webu

<a href="http://dx.doi.org/10.1109/DTIP.2015.7160971" target="_blank" >http://dx.doi.org/10.1109/DTIP.2015.7160971</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/DTIP.2015.7160971" target="_blank" >10.1109/DTIP.2015.7160971</a>

Jazyk výsledku

angličtina

Název v původním jazyce

SU-8 microchannels for live cell dielectrophoresis improvements

Popis výsledku v původním jazyce

In this work a novel SU-8 fabrication technology is employed to construct microfluidic devices for sensitive dielectrophoretic (DEP) manipulation of budding yeast cells. Identical devices were produced with standard soft-lithography processes. In comparison to standard PDMS based soft-lithography, an SU- 8 layer was used to construct the microchannel walls sealed by a flat sheet of PDMS to obtain the microfluidic channels. Direct bonding of PDMS to SU-8 surface was achieved by efficient wet chemical silanization combined with oxygen plasma treatment of the contact surface. The presented fabrication process significantly improved the alignment of the microstructures. In addition, PDMS delamination above electrode topologies was significantly decreased over standard soft-lithography devices. The fabrication time and costs of the proposed methodology were found to be roughly the same. Sensitivity of the devices was tested by discriminating Saccharomyces cerevisiae cells in the G1 phase from cells in the S/G2/M phase using dielectrophoresis. This level of sensitivity necessitated high precision electrode structure that was designed using an FEM model based approach. Attaining such high precision using standard soft-lithography can be difficult due to additional requirements of an alignment stage and its associated tight timing limits.

Název v anglickém jazyce

SU-8 microchannels for live cell dielectrophoresis improvements

Popis výsledku anglicky

In this work a novel SU-8 fabrication technology is employed to construct microfluidic devices for sensitive dielectrophoretic (DEP) manipulation of budding yeast cells. Identical devices were produced with standard soft-lithography processes. In comparison to standard PDMS based soft-lithography, an SU- 8 layer was used to construct the microchannel walls sealed by a flat sheet of PDMS to obtain the microfluidic channels. Direct bonding of PDMS to SU-8 surface was achieved by efficient wet chemical silanization combined with oxygen plasma treatment of the contact surface. The presented fabrication process significantly improved the alignment of the microstructures. In addition, PDMS delamination above electrode topologies was significantly decreased over standard soft-lithography devices. The fabrication time and costs of the proposed methodology were found to be roughly the same. Sensitivity of the devices was tested by discriminating Saccharomyces cerevisiae cells in the G1 phase from cells in the S/G2/M phase using dielectrophoresis. This level of sensitivity necessitated high precision electrode structure that was designed using an FEM model based approach. Attaining such high precision using standard soft-lithography can be difficult due to additional requirements of an alignment stage and its associated tight timing limits.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20205 - Automation and control systems

Projekt

<a href="/cs/project/ED1.1.00%2F02.0090" target="_blank" >ED1.1.00/02.0090: NTIS - Nové technologie pro informační společnost</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Symposium on Design, Test, Integration &amp; Packaging of MEMS/MOEMS (DTIP)

ISBN

978-1-4799-8625-5

ISSN

—

e-ISSN

—

Počet stran výsledku

4

Strana od-do

42-45

Název nakladatele

IEEE

Místo vydání

Montpellier

Místo konání akce

Montpellier, France

Datum konání akce

27. 5. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000380516700010