Composites with micro and nanosilica

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F15%3A43926524" target="_blank" >RIV/49777513:23220/15:43926524 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Composites with micro and nanosilica

Popis výsledku v původním jazyce

For decades high-voltage electrical insulation technology used ternary insulation systems; usually based on modified epoxy resins and reconstructed mica. Adding additional components into existing systems, it is possible to influence their properties. However, the disadvantage is an inhomogeneous composite structure that emerges from the very quality of these materials. Inhomogeneous structure material causes defects during operation that increase material and this can limit the life of the entire device. The key to solving this problem is to reduce the dimensions of the individual components, in this case the filler. This paper deals with the study of electrical insulation properties of composites based on epoxy resin filled with hydrophobic nanosilica and microsilica.

Název v anglickém jazyce

Composites with micro and nanosilica

Popis výsledku anglicky

For decades high-voltage electrical insulation technology used ternary insulation systems; usually based on modified epoxy resins and reconstructed mica. Adding additional components into existing systems, it is possible to influence their properties. However, the disadvantage is an inhomogeneous composite structure that emerges from the very quality of these materials. Inhomogeneous structure material causes defects during operation that increase material and this can limit the life of the entire device. The key to solving this problem is to reduce the dimensions of the individual components, in this case the filler. This paper deals with the study of electrical insulation properties of composites based on epoxy resin filled with hydrophobic nanosilica and microsilica.

Druh

O - Ostatní výsledky

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů