Non-destructive detection methods for discontinuities of interconnection structures

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F16%3A43927492" target="_blank" >RIV/49777513:23220/16:43927492 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.emeraldinsight.com/doi/pdfplus/10.1108/MI-09-2014-0040" target="_blank" >http://www.emeraldinsight.com/doi/pdfplus/10.1108/MI-09-2014-0040</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1108/MI-09-2014-0040" target="_blank" >10.1108/MI-09-2014-0040</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Non-destructive detection methods for discontinuities of interconnection structures

Popis výsledku v původním jazyce

The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

Název v anglickém jazyce

Non-destructive detection methods for discontinuities of interconnection structures

Popis výsledku anglicky

The purpose of this paper is to demonstrate the non-destructive methods for detection and localization of interconnection structure discontinuities based on the signal analysis in the frequency and time domain. The paper deals with the discontinuity characterization of interconnection structures created on substrates used for electronics, and methods for their detection and localization, based on the frequency analysis of transmitted signals. Used analyses are based on the theoretical approach for the solution of discontinuity electrical parameters and are the base for diagnostic methods of discontinuity identification. The measurement results of reflection parameters, frequency spectrums of transmitted signals and characteristic impedance values are presented on test samples containing multiple line cracks and their width reduction. Obtained results can be used practically, not only for the detection of transmission lines discontinuities on printed circuit boards but also in other applications, such as the quality assessment of bonded joints. Developed methods allow the quick identification and localization of particular discontinuities without the destruction of tested devices.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

—

Projekt

<a href="/cs/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regionální inovační centrum elektrotechniky (RICE)</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Microelectronics International

ISSN

1356-5362

e-ISSN

—

Svazek periodika

33

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

GB - Spojené království Velké Británie a Severního Irska

Počet stran výsledku

13

Strana od-do

23-35

Kód UT WoS článku

000370050300004

EID výsledku v databázi Scopus

2-s2.0-84953897923