In-situ monitoring method for curing of pastes used in printed electronics

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F21%3A43962020" target="_blank" >RIV/49777513:23220/21:43962020 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9467541" target="_blank" >https://ieeexplore.ieee.org/document/9467541</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467541" target="_blank" >10.1109/ISSE51996.2021.9467541</a>

Jazyk výsledku

angličtina

Název v původním jazyce

In-situ monitoring method for curing of pastes used in printed electronics

Popis výsledku v původním jazyce

In this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance.

Název v anglickém jazyce

In-situ monitoring method for curing of pastes used in printed electronics

Popis výsledku anglicky

In this paper, a method for in-situ monitoring of curing of materials for printed electronics applications is introduced. Materials for printed electronics in form of inks and pastes need to be cured after printing. Curing is an important post-printing process. Curing is often done at elevated temperatures. The presented method includes a printable layout for conductive inks. The layout represents a large-area application and can be easily inspected by microscopy. The method also includes a specially designed holding frame that holds samples in the air and connects them to the measuring device. During curing the electrical resistance of the printed layout is measured. Presented results show that the curing process can be optimized by changing curing parameters like temperature and time, which is critical for substrates with low heat resistance.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/EF16_026%2F0008382" target="_blank" >EF16_026/0008382: Uhlíkové alotropy s racionalizovanými nanorozhraními a nanospoji pro environmentální a biomedicínské aplikace</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 44th International Spring Seminar on Electronics Technology : /proceedings/

ISBN

978-1-66541-477-7

ISSN

—

e-ISSN

2161-2536

Počet stran výsledku

5

Strana od-do

1-5

Název nakladatele

IEEE

Místo vydání

Piscaway

Místo konání akce

web-basec Conference, Bautzen, Germany

Datum konání akce

5. 5. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853459100011