The Behavior of Cold-Curing Resin after Thermal and UV Radiation Exposures

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F23%3A43968565" target="_blank" >RIV/49777513:23220/23:43968565 - isvavai.cz</a>

Výsledek na webu

<a href="https://pubs.aip.org/aip/acp/article/2778/1/040010/2888671/The-behavior-of-cold-curing-resin-after-thermal" target="_blank" >https://pubs.aip.org/aip/acp/article/2778/1/040010/2888671/The-behavior-of-cold-curing-resin-after-thermal</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1063/5.0135805" target="_blank" >10.1063/5.0135805</a>

Jazyk výsledku

angličtina

Název v původním jazyce

The Behavior of Cold-Curing Resin after Thermal and UV Radiation Exposures

Popis výsledku v původním jazyce

Potting compounds are widely used in electrical engineering. One of the distinctive subgroups is the so-called cold-cure potting compounds. These potting compounds are mainly used for mechanical or photosensitive protection and are thus often exposed to extreme conditions due to their nature of use. The epoxy mixture was subjected to a separate degradation process of elevated temperature (180 °C) and UV-B radiation (peak at 302 nm, 3x20 W) for 500 h. Electrical (volume resistivity, space charge, relative permittivity, dielectric losses), mechanical (tensile strength) and optical (FTIR) methods were used to verify the degree of degradation. From the presented results it can be seen that in terms of volume resistivity there is only a minimal decrease in both cases. However, the change in dielectric behavior is evident in the relative permittivity and loss factor, especially after the glass transition temperature is exceeded in the case of thermally aged material. The different behavior is also observable in terms of space charge trapping and de-trapping. Mechanicaltests showed a significant decrease in tensile strength for the thermally aged material (≥ 50 % decrease). There was also a negative change in the case of UV-B exposure, but not as pronounced (≥ 10 % decrease). The thermal oxidation and photooxidation were confirmed by presence of additional spectral bands at 1740 cm-1 and 1650 cm-1, respectively. These phenomena also resulted in typical discoloration of the samples (temperature: browning, UV-B: yellowing) after the exposure.

Název v anglickém jazyce

The Behavior of Cold-Curing Resin after Thermal and UV Radiation Exposures

Popis výsledku anglicky

Potting compounds are widely used in electrical engineering. One of the distinctive subgroups is the so-called cold-cure potting compounds. These potting compounds are mainly used for mechanical or photosensitive protection and are thus often exposed to extreme conditions due to their nature of use. The epoxy mixture was subjected to a separate degradation process of elevated temperature (180 °C) and UV-B radiation (peak at 302 nm, 3x20 W) for 500 h. Electrical (volume resistivity, space charge, relative permittivity, dielectric losses), mechanical (tensile strength) and optical (FTIR) methods were used to verify the degree of degradation. From the presented results it can be seen that in terms of volume resistivity there is only a minimal decrease in both cases. However, the change in dielectric behavior is evident in the relative permittivity and loss factor, especially after the glass transition temperature is exceeded in the case of thermally aged material. The different behavior is also observable in terms of space charge trapping and de-trapping. Mechanicaltests showed a significant decrease in tensile strength for the thermally aged material (≥ 50 % decrease). There was also a negative change in the case of UV-B exposure, but not as pronounced (≥ 10 % decrease). The thermal oxidation and photooxidation were confirmed by presence of additional spectral bands at 1740 cm-1 and 1650 cm-1, respectively. These phenomena also resulted in typical discoloration of the samples (temperature: browning, UV-B: yellowing) after the exposure.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

AIP Conference proceedings

ISBN

978-0-7354-4479-9

ISSN

0094-243X

e-ISSN

1551-7616

Počet stran výsledku

6

Strana od-do

"040010-1" - 040010-6"

Název nakladatele

American Institute of Physics Inc.

Místo vydání

Melville

Místo konání akce

Štrbské Pleso, Slovakia

Datum konání akce

22. 6. 2022

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

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