Simplified Thermal Analysis and CFD Simulation in Design Process of Power PCB Fitted with SMD

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43973286" target="_blank" >RIV/49777513:23220/24:43973286 - isvavai.cz</a>

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/10726365" target="_blank" >https://ieeexplore.ieee.org/document/10726365</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/PEMC61721.2024.10726365" target="_blank" >10.1109/PEMC61721.2024.10726365</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Simplified Thermal Analysis and CFD Simulation in Design Process of Power PCB Fitted with SMD

Popis výsledku v původním jazyce

This article discusses power losses, heating, and heat distribution on high-power PCBs fitted with high-power SMD components. The paper presents two thermal design methods for power SMD PCBs, compares them with each other, and contrasts them with reference thermal measurements on a PCB prototype. The main contribution of the paper is to evaluate simplified thermal estimation for rapid PCB prototyping and Computational Fluid Dynamics (CFD) thermal simulation for the final design and thermal optimization of the PCB in the PCB thermal design process. Therefore, the paper is divided into two parts. The first part discusses heat estimation using simplified analytical thermal calculations. The second part discusses thermal CFD modeling of PCBs and CFD thermal optimization. For verification purposes, two PCB variants are discussed—direct PCB cooling and double-sided cooling of the power SMD components. Two testing current values are used in the paper—20 A and 50 A.

Název v anglickém jazyce

Simplified Thermal Analysis and CFD Simulation in Design Process of Power PCB Fitted with SMD

Popis výsledku anglicky

This article discusses power losses, heating, and heat distribution on high-power PCBs fitted with high-power SMD components. The paper presents two thermal design methods for power SMD PCBs, compares them with each other, and contrasts them with reference thermal measurements on a PCB prototype. The main contribution of the paper is to evaluate simplified thermal estimation for rapid PCB prototyping and Computational Fluid Dynamics (CFD) thermal simulation for the final design and thermal optimization of the PCB in the PCB thermal design process. Therefore, the paper is divided into two parts. The first part discusses heat estimation using simplified analytical thermal calculations. The second part discusses thermal CFD modeling of PCBs and CFD thermal optimization. For verification purposes, two PCB variants are discussed—direct PCB cooling and double-sided cooling of the power SMD components. Two testing current values are used in the paper—20 A and 50 A.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

<a href="/cs/project/TN02000054" target="_blank" >TN02000054: Národní centrum kompetence inženýrství pozemních vozidel Josefa Božka</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2024

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2024 IEEE 21st International Power Electronics and Motion Control Conference (PEMC)

ISBN

979-8-3503-8523-6

ISSN

2469-8741

e-ISSN

2473-0165

Počet stran výsledku

6

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Pilsen, Czech Republic

Datum konání akce

30. 9. 2024

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

001346863100044