Cooling ability of smooth and dimpled surfaces

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F60162694%3AG43__%2F24%3A00563093" target="_blank" >RIV/60162694:G43__/24:00563093 - isvavai.cz</a>

Výsledek na webu

<a href="https://iopscience.iop.org/article/10.1088/1742-6596/2382/1/012020" target="_blank" >https://iopscience.iop.org/article/10.1088/1742-6596/2382/1/012020</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1088/1742-6596/2382/1/012020" target="_blank" >10.1088/1742-6596/2382/1/012020</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Cooling ability of smooth and dimpled surfaces

Popis výsledku v původním jazyce

Reliable cooling of electronic components is an essential factor in electrical engineering. Every electronic device produces a certain amount of heat during its operation. This heat can cause overheating and a device can suffer damage. Therefore, the issue of cooling plays a significant role and is an important theme appropriate for continuously finding new improvements. The paper describes a quantification of the heat transfer coefficients between a body and a surrounding environment. Experimental research of the heat transfer by cooling is focused on the plane smooth and structured surfaces. Surface structures improving the heat transfer rate are of dimples. The cooling process was measured by using a thermal imaging camera to obtain a cooling curve – the change in temperature time course during air cooling. The analysis of the cooling curve gradient allows us to identify convective and radiant components of the heat transfer. The presented results in the form of diagrams include different cases of air flow around smooth and dimpled surfaces.

Název v anglickém jazyce

Cooling ability of smooth and dimpled surfaces

Popis výsledku anglicky

Reliable cooling of electronic components is an essential factor in electrical engineering. Every electronic device produces a certain amount of heat during its operation. This heat can cause overheating and a device can suffer damage. Therefore, the issue of cooling plays a significant role and is an important theme appropriate for continuously finding new improvements. The paper describes a quantification of the heat transfer coefficients between a body and a surrounding environment. Experimental research of the heat transfer by cooling is focused on the plane smooth and structured surfaces. Surface structures improving the heat transfer rate are of dimples. The cooling process was measured by using a thermal imaging camera to obtain a cooling curve – the change in temperature time course during air cooling. The analysis of the cooling curve gradient allows us to identify convective and radiant components of the heat transfer. The presented results in the form of diagrams include different cases of air flow around smooth and dimpled surfaces.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20303 - Thermodynamics

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Journal of Physics: Conference Series

ISBN

—

ISSN

1742-6588

e-ISSN

1742-6596

Počet stran výsledku

9

Strana od-do

—

Název nakladatele

Institute of Physics

Místo vydání

Bristol

Místo konání akce

Brno, Czech Republic

Datum konání akce

22. 8. 2022

Typ akce podle státní příslušnosti

CST - Celostátní akce

Kód UT WoS článku

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