Research of the Properties of Deposition Soldering with Embedded Tungsten Carbides

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Research of the Properties of Deposition Soldering with Embedded Tungsten Carbides

Popis výsledku v původním jazyce

Copper and nickel-based solders with embedded particles of various sizes of tungsten carbide are widely used in industry. These particles are characterized by high hardness and abrasion resistance, erosion resistance, etc. They can be applied both during renovation and in the manufacturing of new parts for decrusters, screw conveyors and other stressed parts. Each of these parts requires a different surface character, and therefore, a different size of the tungsten carbide particles in the tough solder matrix. Machine components with a deposition soldered surface can be classified into the group of composite materials to replace standard parts from quality steels. The tested soldering materials based on Ni, Cu were applied to the surface using solder brazing technology on the substrate steel S235JR. The diameter of tungsten carbide particles used in these matrices ranges from 38 µm up to 6.0 mm. This research is focused on assessing the microstructure of selected areas, microhardness measurement and a microstructure analysis using a scanning electron microscope. Using a spot chemical analysis, the movement of partial chemical elements between the base material, solder and carbide particles was investigated.

Název v anglickém jazyce

Research of the Properties of Deposition Soldering with Embedded Tungsten Carbides

Popis výsledku anglicky

Copper and nickel-based solders with embedded particles of various sizes of tungsten carbide are widely used in industry. These particles are characterized by high hardness and abrasion resistance, erosion resistance, etc. They can be applied both during renovation and in the manufacturing of new parts for decrusters, screw conveyors and other stressed parts. Each of these parts requires a different surface character, and therefore, a different size of the tungsten carbide particles in the tough solder matrix. Machine components with a deposition soldered surface can be classified into the group of composite materials to replace standard parts from quality steels. The tested soldering materials based on Ni, Cu were applied to the surface using solder brazing technology on the substrate steel S235JR. The diameter of tungsten carbide particles used in these matrices ranges from 38 µm up to 6.0 mm. This research is focused on assessing the microstructure of selected areas, microhardness measurement and a microstructure analysis using a scanning electron microscope. Using a spot chemical analysis, the movement of partial chemical elements between the base material, solder and carbide particles was investigated.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

20301 - Mechanical engineering

Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

METAL 2019 : 28th International Conference on Metallurgy and Materials : abstracts : May 22nd-24th 2019, Hotel Voronez I, Brno, Czech Republic, EU

ISBN

978-80-87294-92-5

ISSN

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e-ISSN

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Počet stran výsledku

5

Strana od-do

1034-1038

Název nakladatele

Tanger

Místo vydání

Ostrava

Místo konání akce

Brno

Datum konání akce

22. 5. 2019

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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