Effect of eggshell powder on the microstructural and thermal behavior of Al7075/waste eggshell surface composites produced by solid-state friction stir processing developed for potential thermal applications

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27230%2F23%3A10252488" target="_blank" >RIV/61989100:27230/23:10252488 - isvavai.cz</a>

Výsledek na webu

<a href="https://link.springer.com/article/10.1007/s00170-023-11600-0" target="_blank" >https://link.springer.com/article/10.1007/s00170-023-11600-0</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s00170-023-11600-0" target="_blank" >10.1007/s00170-023-11600-0</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Effect of eggshell powder on the microstructural and thermal behavior of Al7075/waste eggshell surface composites produced by solid-state friction stir processing developed for potential thermal applications

Popis výsledku v původním jazyce

Lightweight composite materials for potential thermal applications are the contemporary demand for manufacturing and aircraft industries where the possibility to improve and tailor the desired properties is based on the application. Carbonized eggshell powder is a solid lubricant with absorbent capability and has proven as a reinforcement for metallic base composites. In the present work, an attempt is made to investigate the effect of carbonized chicken eggshell powder (3 to 9% by weight) on the microstructural and thermal properties of Al7075 alloy processed by solid-state friction stir processing. An infrared thermography and three K-type thermocouples equipped with the base plate at three equal distances are used to measure the temperature with respect to time. The comparative study of microstructure and grain structure analysis has been done by light microscopy, scanning electron microscopy, and electron backscattered diffraction methods. The findings explored the dynamic recrystallization and grain recovery with a reduced grain size of 6.2 to 10.3 mu m at a varying percentage of eggshell powder (3 to 9%) in the stir zone. The thermal conductivity and coefficient of thermal expansion (CTE) were measured for the temperature range of 50 to 400 degrees C. In addition to it, differential thermal analysis (DTA), thermo-gravimetric analysis (TGA), and derivative thermo-gravimetric analysis (DTG) are conducted for the temperature range of 25 to 900 degrees C to discuss the endothermic, exothermic nature, and degradation characteristics. The result revealed the decreasing trend of thermal conductivity, and CTE values were found in the range of 97 to 53 W/mK and 26.6 to 24 x 10(-6) K-1 (heating cycle), 27.2 to 23.8 x 10(-6) K-1(cooling cycle), respectively. Furthermore, the higher and lower thermal conductivity of 108 W/mK and 62 W/mK is observed at higher and lower terminal voltages, 250 V and 100 V, respectively. The DTA, TGA, and DTG curves explored the maximum weight loss, which varies up to 5.25% with exothermic peaks and decomposition steps for each surface composite.

Název v anglickém jazyce

Effect of eggshell powder on the microstructural and thermal behavior of Al7075/waste eggshell surface composites produced by solid-state friction stir processing developed for potential thermal applications

Popis výsledku anglicky

Lightweight composite materials for potential thermal applications are the contemporary demand for manufacturing and aircraft industries where the possibility to improve and tailor the desired properties is based on the application. Carbonized eggshell powder is a solid lubricant with absorbent capability and has proven as a reinforcement for metallic base composites. In the present work, an attempt is made to investigate the effect of carbonized chicken eggshell powder (3 to 9% by weight) on the microstructural and thermal properties of Al7075 alloy processed by solid-state friction stir processing. An infrared thermography and three K-type thermocouples equipped with the base plate at three equal distances are used to measure the temperature with respect to time. The comparative study of microstructure and grain structure analysis has been done by light microscopy, scanning electron microscopy, and electron backscattered diffraction methods. The findings explored the dynamic recrystallization and grain recovery with a reduced grain size of 6.2 to 10.3 mu m at a varying percentage of eggshell powder (3 to 9%) in the stir zone. The thermal conductivity and coefficient of thermal expansion (CTE) were measured for the temperature range of 50 to 400 degrees C. In addition to it, differential thermal analysis (DTA), thermo-gravimetric analysis (TGA), and derivative thermo-gravimetric analysis (DTG) are conducted for the temperature range of 25 to 900 degrees C to discuss the endothermic, exothermic nature, and degradation characteristics. The result revealed the decreasing trend of thermal conductivity, and CTE values were found in the range of 97 to 53 W/mK and 26.6 to 24 x 10(-6) K-1 (heating cycle), 27.2 to 23.8 x 10(-6) K-1(cooling cycle), respectively. Furthermore, the higher and lower thermal conductivity of 108 W/mK and 62 W/mK is observed at higher and lower terminal voltages, 250 V and 100 V, respectively. The DTA, TGA, and DTG curves explored the maximum weight loss, which varies up to 5.25% with exothermic peaks and decomposition steps for each surface composite.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

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OECD FORD obor

20301 - Mechanical engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

The international journal of advanced manufacturing technology

ISSN

0268-3768

e-ISSN

1433-3015

Svazek periodika

127

Číslo periodika v rámci svazku

25 MAY 2023

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

19

Strana od-do

1243-1261

Kód UT WoS článku

000994104600003

EID výsledku v databázi Scopus

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