Design of experimental liquid heat sink for high power electronic

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27240%2F14%3A86093486" target="_blank" >RIV/61989100:27240/14:86093486 - isvavai.cz</a>

Výsledek na webu

<a href="http://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=6835900&isnumber=6835825" target="_blank" >http://ieeexplore.ieee.org/stampPDF/getPDF.jsp?arnumber=6835900&isnumber=6835825</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/EEEIC.2014.6835900" target="_blank" >10.1109/EEEIC.2014.6835900</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Design of experimental liquid heat sink for high power electronic

Popis výsledku v původním jazyce

This article deals with issue of fluid heat sinks for power electronics. In the introduction there are listed different kinds of heat sinks depending on the complexity of heat sink structure. From this split the group of fluid heat sinks is selected. Chapter of cooling media is based on this chapter. The proposal of special liquid heat sink has been implemented from previous chapters. This heat sink is designed to create turbulent flow of fluid in cooling duct. The thermal simulations are subsequently carried out in this heat sink. Individual simulations are conducted for constant power loss. The simulation of one part of the heat sink is carried out and the whole simulation of heat sink with 3 capacity modules consisting of six IGBT transistors is conducted. Further the simulations of currently accessible fluid heat sinks WP16 and KL494 are provided. All results of simulations are shown in tables.

Název v anglickém jazyce

Design of experimental liquid heat sink for high power electronic

Popis výsledku anglicky

This article deals with issue of fluid heat sinks for power electronics. In the introduction there are listed different kinds of heat sinks depending on the complexity of heat sink structure. From this split the group of fluid heat sinks is selected. Chapter of cooling media is based on this chapter. The proposal of special liquid heat sink has been implemented from previous chapters. This heat sink is designed to create turbulent flow of fluid in cooling duct. The thermal simulations are subsequently carried out in this heat sink. Individual simulations are conducted for constant power loss. The simulation of one part of the heat sink is carried out and the whole simulation of heat sink with 3 capacity modules consisting of six IGBT transistors is conducted. Further the simulations of currently accessible fluid heat sinks WP16 and KL494 are provided. All results of simulations are shown in tables.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2014

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2014 14TH INTERNATIONAL CONFERENCE ON ENVIRONMENT AND ELECTRICAL ENGINEERING (EEEIC)

ISBN

978-1-4799-4660-0

ISSN

—

e-ISSN

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Počet stran výsledku

5

Strana od-do

392-396

Název nakladatele

IEEE

Místo vydání

New York

Místo konání akce

Krakow

Datum konání akce

10. 5. 2014

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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