High Voltage PCBs in Low Pressure and High Temperature Environment

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F61989100%3A27240%2F21%3A10248538" target="_blank" >RIV/61989100:27240/21:10248538 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/61989100:27730/21:10248538

Výsledek na webu

<a href="https://ieeexplore.ieee.org/document/9576958" target="_blank" >https://ieeexplore.ieee.org/document/9576958</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/WZEE54157.2021.9576958" target="_blank" >10.1109/WZEE54157.2021.9576958</a>

Jazyk výsledku

angličtina

Název v původním jazyce

High Voltage PCBs in Low Pressure and High Temperature Environment

Popis výsledku v původním jazyce

This paper describes the issues of high voltage printed circuit boards (PCB) design in environments with lower air pressure and increased temperature. Such ambient conditions have significant impact on breakdown voltage, as it is described by Paschen&apos;s curve. As this field was yet to be thoroughly investigated, there are major gaps in available literature. Pashen&apos;s curve with temperature corrections, which describes relation between air pressure and breakdown voltage, can be used for clearance estimation only, because it considers a gas as dielectric. In the following paragraphs, overview of printed circuit boards is described with respect to minimization of partial discharge activity and electric breakdown occurrence. (C) 2021 IEEE.

Název v anglickém jazyce

High Voltage PCBs in Low Pressure and High Temperature Environment

Popis výsledku anglicky

This paper describes the issues of high voltage printed circuit boards (PCB) design in environments with lower air pressure and increased temperature. Such ambient conditions have significant impact on breakdown voltage, as it is described by Paschen&apos;s curve. As this field was yet to be thoroughly investigated, there are major gaps in available literature. Pashen&apos;s curve with temperature corrections, which describes relation between air pressure and breakdown voltage, can be used for clearance estimation only, because it considers a gas as dielectric. In the following paragraphs, overview of printed circuit boards is described with respect to minimization of partial discharge activity and electric breakdown occurrence. (C) 2021 IEEE.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2021

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2021 Selected Issues of Electrical Engineering and Electronics : WZEE 2021

ISBN

978-1-66542-164-5

ISSN

—

e-ISSN

—

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE

Místo vydání

Piscataway

Místo konání akce

Řešov

Datum konání akce

13. 9. 2021

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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