Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F12%3A00386299" target="_blank" >RIV/68081723:_____/12:00386299 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1007/s11665-012-0125-3" target="_blank" >http://dx.doi.org/10.1007/s11665-012-0125-3</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s11665-012-0125-3" target="_blank" >10.1007/s11665-012-0125-3</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Popis výsledku v původním jazyce

The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is thesubject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions

Název v anglickém jazyce

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

Popis výsledku anglicky

The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M 220 °C), but the use of lead in the solders for high-temperature applications (>85% lead, T M 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is thesubject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BJ - Termodynamika

OECD FORD obor

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Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2012

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Materials Engineering and Performance

ISSN

1059-9495

e-ISSN

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Svazek periodika

21

Číslo periodika v rámci svazku

5

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

9

Strana od-do

629-637

Kód UT WoS článku

000303455900010

EID výsledku v databázi Scopus

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