In-Situ Testing and Heterogeneity of UFG Cu at Elevated Temperatures

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68081723%3A_____%2F15%3A00450289" target="_blank" >RIV/68081723:_____/15:00450289 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.4028/www.scientific.net/AMR.1127" target="_blank" >http://dx.doi.org/10.4028/www.scientific.net/AMR.1127</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.4028/www.scientific.net/AMR.1127" target="_blank" >10.4028/www.scientific.net/AMR.1127</a>

Jazyk výsledku

angličtina

Název v původním jazyce

In-Situ Testing and Heterogeneity of UFG Cu at Elevated Temperatures

Popis výsledku v původním jazyce

Experiments were conducted to investigate deformation-induced processes during in-situ tensile test at elevated temperature. Consequently the microstructure after creep loading was examined by 3D Electron Back Scatter Diffraction (EBSD) technique. The billets of coarse-grained copper were processed by ECAP at room temperature by route Bc by 8 ECAP passes. The constant strain-rate test in tension was performed at 473 K using testing GATAN stage Microtest 2000EW with EH 2000 heated grips which is configured for in-situ electron back scatter diffraction (EBSD) observations. Microstructure was examined by FEG-SEM TESCAN MIRA 3 XM equipped by EBSD detector HKL NordlysMax from OXFORD INSTRUMENT. The tensile test was interrupted by fast stress reductions after different deformation step and observation of microstructure changes was performed. In the present work was found that ultrafine-grained microstructure is instable and significant grain growth has already occurred during heating to the

Název v anglickém jazyce

In-Situ Testing and Heterogeneity of UFG Cu at Elevated Temperatures

Popis výsledku anglicky

Experiments were conducted to investigate deformation-induced processes during in-situ tensile test at elevated temperature. Consequently the microstructure after creep loading was examined by 3D Electron Back Scatter Diffraction (EBSD) technique. The billets of coarse-grained copper were processed by ECAP at room temperature by route Bc by 8 ECAP passes. The constant strain-rate test in tension was performed at 473 K using testing GATAN stage Microtest 2000EW with EH 2000 heated grips which is configured for in-situ electron back scatter diffraction (EBSD) observations. Microstructure was examined by FEG-SEM TESCAN MIRA 3 XM equipped by EBSD detector HKL NordlysMax from OXFORD INSTRUMENT. The tensile test was interrupted by fast stress reductions after different deformation step and observation of microstructure changes was performed. In the present work was found that ultrafine-grained microstructure is instable and significant grain growth has already occurred during heating to the

Druh

D - Stať ve sborníku

CEP obor

JJ - Ostatní materiály

OECD FORD obor

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Projekt

<a href="/cs/project/GAP108%2F11%2F2260" target="_blank" >GAP108/11/2260: Vztah mezi mikrostrukturou a creepovým chováním precipitačně zpevněných slitin připravených metodou ECAP</a><br>

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2015

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

COMAT 2014 - Recent Trends in Structural Materials

ISBN

978-3-03835-623-3

ISSN

—

e-ISSN

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Počet stran výsledku

6

Strana od-do

67-72

Název nakladatele

Trans Tech Publications

Místo vydání

Zurich

Místo konání akce

Plzeň

Datum konání akce

19. 11. 2015

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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