Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F11%3A00368419" target="_blank" >RIV/68378271:_____/11:00368419 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.3139/146.110596" target="_blank" >http://dx.doi.org/10.3139/146.110596</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3139/146.110596" target="_blank" >10.3139/146.110596</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures

Popis výsledku v původním jazyce

The recovery stress evolution during thermal cycling (heating, isothermal holding, cooling) to temperatures significantly above the austenite finish temperature in Ni ?Ti ? Cu thin wires was evaluated in a dynamic mechanical analyser DMA TQ800. Ni ?Ti?Cuwires were annealed at four different temperatures (350 °C, 450°C, 550 °C and 650 °C). It was observed that the maximum recovery stress significantly decreases with increasing annealing temperature. It was also observed that the recovery stress during four isothermal holdings shows similar behaviour for all annealing temperatures, i. e. stress relaxation occurs after initial stress increase during the first isothermal holding and no stress relaxation is observed during isothermal holdings in subsequentthermal cycles.

Název v anglickém jazyce

Recovery stress and shape memory stability in Ni-Ti-Cu thin wires at high temperatures

Popis výsledku anglicky

The recovery stress evolution during thermal cycling (heating, isothermal holding, cooling) to temperatures significantly above the austenite finish temperature in Ni ?Ti ? Cu thin wires was evaluated in a dynamic mechanical analyser DMA TQ800. Ni ?Ti?Cuwires were annealed at four different temperatures (350 °C, 450°C, 550 °C and 650 °C). It was observed that the maximum recovery stress significantly decreases with increasing annealing temperature. It was also observed that the recovery stress during four isothermal holdings shows similar behaviour for all annealing temperatures, i. e. stress relaxation occurs after initial stress increase during the first isothermal holding and no stress relaxation is observed during isothermal holdings in subsequentthermal cycles.

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BM - Fyzika pevných látek a magnetismus

OECD FORD obor

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Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

International Journal of Materials Research

ISSN

1862-5282

e-ISSN

—

Svazek periodika

102

Číslo periodika v rámci svazku

11

Stát vydavatele periodika

DE - Spolková republika Německo

Počet stran výsledku

7

Strana od-do

1362-1368

Kód UT WoS článku

000297955000007

EID výsledku v databázi Scopus

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