Optical and thermal simulation chain for LED package

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F16%3A00309281" target="_blank" >RIV/68407700:21110/16:00309281 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/EuroSimE.2016.7463349" target="_blank" >http://dx.doi.org/10.1109/EuroSimE.2016.7463349</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/EuroSimE.2016.7463349" target="_blank" >10.1109/EuroSimE.2016.7463349</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Optical and thermal simulation chain for LED package

Popis výsledku v původním jazyce

This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

Název v anglickém jazyce

Optical and thermal simulation chain for LED package

Popis výsledku anglicky

This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

Druh

D - Stať ve sborníku

CEP obor

JI - Kompositní materiály

OECD FORD obor

—

Projekt

—

Návaznosti

R - Projekt Ramcoveho programu EK

Rok uplatnění

2016

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

ISBN

978-1-5090-2106-2

ISSN

—

e-ISSN

—

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE

Místo vydání

—

Místo konání akce

Montpellier

Datum konání akce

17. 4. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000381743700057