Toward a logistic model of dynamic mold growth on wood

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21110%2F23%3A00366193" target="_blank" >RIV/68407700:21110/23:00366193 - isvavai.cz</a>

Nalezeny alternativní kódy

RIV/68407700:21720/23:00366193

Výsledek na webu

<a href="https://doi.org/10.1007/s00226-023-01473-7" target="_blank" >https://doi.org/10.1007/s00226-023-01473-7</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1007/s00226-023-01473-7" target="_blank" >10.1007/s00226-023-01473-7</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Toward a logistic model of dynamic mold growth on wood

Popis výsledku v původním jazyce

This paper deals with mathematical modeling of mold growth on wood. The logistic growth equation is used to model mold growth phenomena in changing environmental conditions. Microscopic mold coverage fraction is used in the logistic equation to represent mold development on a material surface over time. The current state-of-the-art dynamic Finnish mold growth model is used as the reference model for development of the logistic mold growth model. The optimal values of mold growth coefficient are estimated by simulations of mold growth under constant environmental conditions and by finding the best agreement with the Finnish mold growth model using mathematical optimization methods. It is shown that the mold growth coefficient can be approximated as a function of relative humidity, temperature, wood species and the quality of the surface. The model parameters are then verified by a comparison with the Finnish mold growth model. In this case, cyclic step changes of constant relative humidity are used. Finally, the logistic mold growth model is compared with published experimental observations of mold growth. The discrepancy of mold growth models and experimental mold growth data, and possible improvements are discussed.

Název v anglickém jazyce

Toward a logistic model of dynamic mold growth on wood

Popis výsledku anglicky

This paper deals with mathematical modeling of mold growth on wood. The logistic growth equation is used to model mold growth phenomena in changing environmental conditions. Microscopic mold coverage fraction is used in the logistic equation to represent mold development on a material surface over time. The current state-of-the-art dynamic Finnish mold growth model is used as the reference model for development of the logistic mold growth model. The optimal values of mold growth coefficient are estimated by simulations of mold growth under constant environmental conditions and by finding the best agreement with the Finnish mold growth model using mathematical optimization methods. It is shown that the mold growth coefficient can be approximated as a function of relative humidity, temperature, wood species and the quality of the surface. The model parameters are then verified by a comparison with the Finnish mold growth model. In this case, cyclic step changes of constant relative humidity are used. Finally, the logistic mold growth model is compared with published experimental observations of mold growth. The discrepancy of mold growth models and experimental mold growth data, and possible improvements are discussed.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20101 - Civil engineering

Projekt

<a href="/cs/project/GA20-12941S" target="_blank" >GA20-12941S: Růst plísní na povrchové vrstvě rostlého dřeva za proměnných okrajových podmínek</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2023

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Wood Science and Technology

ISSN

0043-7719

e-ISSN

1432-5225

Svazek periodika

57

Číslo periodika v rámci svazku

3

Stát vydavatele periodika

DE - Spolková republika Německo

Počet stran výsledku

22

Strana od-do

759-780

Kód UT WoS článku

000976804200002

EID výsledku v databázi Scopus

2-s2.0-85153623225