Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile

Popis výsledku v původním jazyce

Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient.

Název v anglickém jazyce

Degradation of Two-Compound Electrically Conductive Adhesive in Relation to Curing Temperature Profile

Popis výsledku anglicky

Electrically Conductive Adhesives (ECAs) are spreading the electronic industry, often deployed in adverse climatic conditions. A series of accelerated climatic experiments was undertaken to gather more information about this technology and its environmental stability. During these tests, an interesting behavior of the two-component ECAs was observed: a sharp drop of electrical resistance in a short time after the curing of the ECA. This indicated a possible problem with the stability of two-component ECAs and mandated further research. Its results are published in this paper and seem to support the validity of the original finding - that there exists a possible risk when using certain conductive adhesives and that manufacturer-supplied curing temperature profiles might, in some cases, be insufficient.

Druh

D - Stať ve sborníku

CEP obor

JA - Elektronika a optoelektronika, elektrotechnika

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Applied Electronic 2011

ISBN

978-80-7043-987-6

ISSN

1803-7232

e-ISSN

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Počet stran výsledku

4

Strana od-do

393-396

Název nakladatele

University of West Bohemia

Místo vydání

Plzeň

Místo konání akce

Plzeň

Datum konání akce

7. 9. 2011

Typ akce podle státní příslušnosti

EUR - Evropská akce

Kód UT WoS článku

000305136600087