Low-Loss and Low-Back-Reflection Hollow-Core to Standard Fiber Interconnection

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00331282" target="_blank" >RIV/68407700:21230/19:00331282 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/LPT.2019.2902635" target="_blank" >https://doi.org/10.1109/LPT.2019.2902635</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/LPT.2019.2902635" target="_blank" >10.1109/LPT.2019.2902635</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Low-Loss and Low-Back-Reflection Hollow-Core to Standard Fiber Interconnection

Popis výsledku v původním jazyce

We present a new approach to permanently inter-connect hollow-core fiber (HCF) to solid-core fiber, which does not involve fusion splicing. Our approach is based on a modification of the glue-based fiber-array technology routinely used for fiber pigtailing of planar lightwave circuits. The resulting interconnection provides for a low insertion loss due to the fact that the HCF microstructure is not deformed during the gluing (low temperature) process that is almost impossible to achieve with the standard (high temperature) fusion splicing method. Furthermore, this low-temperature technique enables the deposition and preservation of thin films deposited at the solid-to-hollow core fiber interface, allowing for additional functionality without the introduction of extra losses or any increase in complexity. To demonstrate this, we have applied an anti-reflection (AR) coating. A further feature of our approach is the ability to control very precisely the length of the graded-index (GRIN) fiber mode field (MF) adapter inserted in between the standard single-mode fiber (SMF-28) and the HCF. We show experimentally how the length of the GRIN fiber MF adapter influences the coupling between the SMF-28 and the fundamental as well as the higher-order modes of the HCF. We coupled between SMF-28 [10μm mode field diameter (MFD)] and the fundamental mode of a 19-cell hollow-core photonic bandgap fiber (HC-PBGF, 21.1μm MFD) with the lowest-ever reported insertion loss of 0.30dB per interface.

Název v anglickém jazyce

Low-Loss and Low-Back-Reflection Hollow-Core to Standard Fiber Interconnection

Popis výsledku anglicky

We present a new approach to permanently inter-connect hollow-core fiber (HCF) to solid-core fiber, which does not involve fusion splicing. Our approach is based on a modification of the glue-based fiber-array technology routinely used for fiber pigtailing of planar lightwave circuits. The resulting interconnection provides for a low insertion loss due to the fact that the HCF microstructure is not deformed during the gluing (low temperature) process that is almost impossible to achieve with the standard (high temperature) fusion splicing method. Furthermore, this low-temperature technique enables the deposition and preservation of thin films deposited at the solid-to-hollow core fiber interface, allowing for additional functionality without the introduction of extra losses or any increase in complexity. To demonstrate this, we have applied an anti-reflection (AR) coating. A further feature of our approach is the ability to control very precisely the length of the graded-index (GRIN) fiber mode field (MF) adapter inserted in between the standard single-mode fiber (SMF-28) and the HCF. We show experimentally how the length of the GRIN fiber MF adapter influences the coupling between the SMF-28 and the fundamental as well as the higher-order modes of the HCF. We coupled between SMF-28 [10μm mode field diameter (MFD)] and the fundamental mode of a 19-cell hollow-core photonic bandgap fiber (HC-PBGF, 21.1μm MFD) with the lowest-ever reported insertion loss of 0.30dB per interface.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IEEE Photonics Technology Letters

ISSN

1041-1135

e-ISSN

1941-0174

Svazek periodika

31

Číslo periodika v rámci svazku

10

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

4

Strana od-do

723-726

Kód UT WoS článku

000467571000001

EID výsledku v databázi Scopus

2-s2.0-85065589418