Platform Tolerant, High Encoding Capacity Dipole Array-Plate Chipless RFID Tags

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00332405" target="_blank" >RIV/68407700:21230/19:00332405 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ACCESS.2019.2935258" target="_blank" >https://doi.org/10.1109/ACCESS.2019.2935258</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ACCESS.2019.2935258" target="_blank" >10.1109/ACCESS.2019.2935258</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Platform Tolerant, High Encoding Capacity Dipole Array-Plate Chipless RFID Tags

Popis výsledku v původním jazyce

In this paper, we first carry out an in-depth review of the performance parameters of frequency domain chipless RFID transponders in terms of their spatial density, spectral capacity, and comprehensive encoding capacity (bit/lambda2/GHz) comprising both spatial and spectral performance, and platform tolerance. Secondly, we theoretically and numerically investigate the recently introduced and promising concept of the platform-tolerant chipless RFID transponder based on a detuned dipole array-plate that provides high encoding capacity. We propose, fabricate and measure a 20-bit transponder consisting of an array of 20 detuned dipoles closely coupled to a 60 x 60 mm2 metallic plate. The radar cross section at the level of 15 dBsm exhibits reliably recognizable minima corresponding to individual dipole resonances. When compared to other published frequency-domain chipless RFID transponders, the encoding capacity reaches 47.4 bit/lambda2/GHz, which constitutes one of the highest values, while achieving a concurrently high level of radar cross section (RCS) reflection response and platform tolerance performance. The measurements confirm very good performance parameters in the cases when the transponder is attached to various packaging materials, such as cardboard, plastic, wood, metal or a human body phantom. The essential benefits of the presented solution include a very good frequency and amplitude stability in the RCS response, which enables a reliable reading of encoded information (if zero bits are coded). The double layer metallization represents an inherent property of the proposed solution, which is a necessary trade-off for high encoding capacity and contemporary platform tolerance.

Název v anglickém jazyce

Platform Tolerant, High Encoding Capacity Dipole Array-Plate Chipless RFID Tags

Popis výsledku anglicky

In this paper, we first carry out an in-depth review of the performance parameters of frequency domain chipless RFID transponders in terms of their spatial density, spectral capacity, and comprehensive encoding capacity (bit/lambda2/GHz) comprising both spatial and spectral performance, and platform tolerance. Secondly, we theoretically and numerically investigate the recently introduced and promising concept of the platform-tolerant chipless RFID transponder based on a detuned dipole array-plate that provides high encoding capacity. We propose, fabricate and measure a 20-bit transponder consisting of an array of 20 detuned dipoles closely coupled to a 60 x 60 mm2 metallic plate. The radar cross section at the level of 15 dBsm exhibits reliably recognizable minima corresponding to individual dipole resonances. When compared to other published frequency-domain chipless RFID transponders, the encoding capacity reaches 47.4 bit/lambda2/GHz, which constitutes one of the highest values, while achieving a concurrently high level of radar cross section (RCS) reflection response and platform tolerance performance. The measurements confirm very good performance parameters in the cases when the transponder is attached to various packaging materials, such as cardboard, plastic, wood, metal or a human body phantom. The essential benefits of the presented solution include a very good frequency and amplitude stability in the RCS response, which enables a reliable reading of encoded information (if zero bits are coded). The double layer metallization represents an inherent property of the proposed solution, which is a necessary trade-off for high encoding capacity and contemporary platform tolerance.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Rok uplatnění

2019

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IEEE Access

ISSN

2169-3536

e-ISSN

2169-3536

Svazek periodika

7

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

14

Strana od-do

138707-138720

Kód UT WoS článku

000498719600004

EID výsledku v databázi Scopus

2-s2.0-85077819067