Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00362935" target="_blank" >RIV/68407700:21230/22:00362935 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/ISSE54558.2022.9812817" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812817</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812817" target="_blank" >10.1109/ISSE54558.2022.9812817</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints

Popis výsledku v původním jazyce

In this work, the resistance of joints formed by two types of conductive adhesives with isotropic electrical conductivity on pads with copper and gold surface finish is monitored. The joints are climatically loaded by heat shocks and exposure to elevated temperature and humidity. The method of factor experiments and Taguchi's orthogonal arrays are used to determine which of these climatic factors has a more significant effect on the change in joint resistance. It was found that the dominant aging factor differs for different adhesives and that the results obtained by both methods are close in cases where the effect of factor interactions on the joint resistance is small.

Název v anglickém jazyce

Using Dispersion Analysis to Study the Climatic Aging of Conductive Adhesive Joints

Popis výsledku anglicky

In this work, the resistance of joints formed by two types of conductive adhesives with isotropic electrical conductivity on pads with copper and gold surface finish is monitored. The joints are climatically loaded by heat shocks and exposure to elevated temperature and humidity. The method of factor experiments and Taguchi's orthogonal arrays are used to determine which of these climatic factors has a more significant effect on the change in joint resistance. It was found that the dominant aging factor differs for different adhesives and that the results obtained by both methods are close in cases where the effect of factor interactions on the joint resistance is small.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20201 - Electrical and electronic engineering

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 45th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-6589-2

ISSN

2161-2528

e-ISSN

2161-2536

Počet stran výsledku

6

Strana od-do

1-6

Název nakladatele

IEEE Press

Místo vydání

New York

Místo konání akce

Vienna

Datum konání akce

11. 5. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000853642200058