Laser Brackets Debonding: Tm:YAP, Nd:YAG, and Two Diode Lasers Evaluation

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21340%2F09%3A00156974" target="_blank" >RIV/68407700:21340/09:00156974 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Laser Brackets Debonding: Tm:YAP, Nd:YAG, and Two Diode Lasers Evaluation

Popis výsledku v původním jazyce

The study demonstrates the possibility of using laser radiation for ceramic bracket removing. Three laser radiations were examined for this effect, and the removing possibility and velocity together with enamel and pulp damage were investigated. The lasers used were: a diode-pumped Tm:YAP microchip laser, diode pumped Nd:YAG laser, and GaAs diode generating 1.9 um, 1.44 um, and 0.808 um, respectively. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel - was also made with the goal to explain the source of heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that the continuously running diode pumped microchip Tm:YAP laserhaving output power 1W can be a good candidate for the ceramic bracket debonding procedure.

Název v anglickém jazyce

Laser Brackets Debonding: Tm:YAP, Nd:YAG, and Two Diode Lasers Evaluation

Popis výsledku anglicky

The study demonstrates the possibility of using laser radiation for ceramic bracket removing. Three laser radiations were examined for this effect, and the removing possibility and velocity together with enamel and pulp damage were investigated. The lasers used were: a diode-pumped Tm:YAP microchip laser, diode pumped Nd:YAG laser, and GaAs diode generating 1.9 um, 1.44 um, and 0.808 um, respectively. The measurement of transmission and absorption of the basic element - bracket, adhesive resin, and enamel - was also made with the goal to explain the source of heat and bracket debonding. The explanation of the debonding effect is also presented. From the results it is possible to conclude that the continuously running diode pumped microchip Tm:YAP laserhaving output power 1W can be a good candidate for the ceramic bracket debonding procedure.

Druh

D - Stať ve sborníku

CEP obor

BH - Optika, masery a lasery

OECD FORD obor

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Projekt

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Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceeding of SPIE 7162 - Lasers in Dentistry XV

ISBN

978-0-8194-7408-7

ISSN

1605-7422

e-ISSN

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Počet stran výsledku

6

Strana od-do

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Název nakladatele

SPIE

Místo vydání

Bellingham

Místo konání akce

San Jose, (CA)

Datum konání akce

24. 1. 2009

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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