Characterization of Medipix3 With Synchrotron Radiation

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21670%2F11%3A00191133" target="_blank" >RIV/68407700:21670/11:00191133 - isvavai.cz</a>

Výsledek na webu

<a href="http://dx.doi.org/10.1109/TNS.2010.2089062" target="_blank" >http://dx.doi.org/10.1109/TNS.2010.2089062</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/TNS.2010.2089062" target="_blank" >10.1109/TNS.2010.2089062</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Characterization of Medipix3 With Synchrotron Radiation

Popis výsledku v původním jazyce

Medipix3 is the latest generation of photon counting readout chips of the Medipix family. With the same dimensions as Medipix2 (256 x 256 pixels of 55 mu m x 55 mu m pitch each), Medipix3 is however implemented in an 8-layer metallization 0.13 mu m CMOStechnology which leads to an increase in the functionality associated with each pixel over Medipix2. One of the new operational modes implemented in the front-end architecture is the Charge Summing Mode (CSM). This mode consists of a charge reconstruction and hit allocation algorithm which eliminates event-by-event the low energy counts produced by charge-shared events between adjacent pixels. The present work focuses on the study of the CSM mode and compares it to the Single Pixel Mode (SPM) which is the conventional readout method for these kind of detectors and it is also implemented in Medipix3. Tests of a Medipix3 chip bump-bonded to a 300 mu m thick silicon photodiode sensor were performed at the Diamond Light Source synchrotron t

Název v anglickém jazyce

Characterization of Medipix3 With Synchrotron Radiation

Popis výsledku anglicky

Medipix3 is the latest generation of photon counting readout chips of the Medipix family. With the same dimensions as Medipix2 (256 x 256 pixels of 55 mu m x 55 mu m pitch each), Medipix3 is however implemented in an 8-layer metallization 0.13 mu m CMOStechnology which leads to an increase in the functionality associated with each pixel over Medipix2. One of the new operational modes implemented in the front-end architecture is the Charge Summing Mode (CSM). This mode consists of a charge reconstruction and hit allocation algorithm which eliminates event-by-event the low energy counts produced by charge-shared events between adjacent pixels. The present work focuses on the study of the CSM mode and compares it to the Single Pixel Mode (SPM) which is the conventional readout method for these kind of detectors and it is also implemented in Medipix3. Tests of a Medipix3 chip bump-bonded to a 300 mu m thick silicon photodiode sensor were performed at the Diamond Light Source synchrotron t

Druh

J_x - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)

CEP obor

BG - Jaderná, atomová a molekulová fyzika, urychlovače

OECD FORD obor

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Projekt

—

Návaznosti

Z - Vyzkumny zamer (s odkazem do CEZ)

Rok uplatnění

2011

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

IEEE Transactions on Nuclear Science

ISSN

0018-9499

e-ISSN

—

Svazek periodika

58

Číslo periodika v rámci svazku

1

Stát vydavatele periodika

US - Spojené státy americké

Počet stran výsledku

10

Strana od-do

323-332

Kód UT WoS článku

000287086200020

EID výsledku v databázi Scopus

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