First Coupling of AC-LGAD Sensors to a Timepix3 Chip

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21670%2F22%3A00373051" target="_blank" >RIV/68407700:21670/22:00373051 - isvavai.cz</a>

Výsledek na webu

<a href="https://doi.org/10.1109/NSS/MIC44845.2022.10398946" target="_blank" >https://doi.org/10.1109/NSS/MIC44845.2022.10398946</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/NSS/MIC44845.2022.10398946" target="_blank" >10.1109/NSS/MIC44845.2022.10398946</a>

Jazyk výsledku

angličtina

Název v původním jazyce

First Coupling of AC-LGAD Sensors to a Timepix3 Chip

Popis výsledku v původním jazyce

Since their introduction in 2015, AC-coupled Low Gain Avalanche Diode (AC-LGAD) sensors have attracted widespread interest in the scientific community for their ability to provide high spatial resolution while keeping the excellent timing capabilities typical of standard (DC-)LGAD sensors. This is achieved in AC-LGADs because the signal from particle interactions is capacitively induced on fine-pitched electrodes placed over an insulator and is shared among multiple electrodes. AC-LGADs are therefore considered as promising candidates for future detectors such as EIC to provide 4-dimensional measurements with high resolution in both space and time dimensions. AC-LGAD sensors designed and fabricated at the Brookhaven National Laboratory (USA) have been coupled to Timepix3, a pixel detector read-out chip for X-ray imaging and particle track reconstruction developed by the Medipix3 collaboration, offering pixel-level threshold adjustment on a 256x256 pixel matrix and high precision Time-of-Arrival and Time Over Threshold measurement of incoming particles. Three different AC-LGAD strip detectors, custom designed to fit the Timepix3 chip specifications, have been bonded onto a single Timepix3 chip. Studies of the electrical coupling of the two systems and the characterization of AC-LGAD signals readout by the Timepix3 chip are discussed in this work.

Název v anglickém jazyce

First Coupling of AC-LGAD Sensors to a Timepix3 Chip

Popis výsledku anglicky

Since their introduction in 2015, AC-coupled Low Gain Avalanche Diode (AC-LGAD) sensors have attracted widespread interest in the scientific community for their ability to provide high spatial resolution while keeping the excellent timing capabilities typical of standard (DC-)LGAD sensors. This is achieved in AC-LGADs because the signal from particle interactions is capacitively induced on fine-pitched electrodes placed over an insulator and is shared among multiple electrodes. AC-LGADs are therefore considered as promising candidates for future detectors such as EIC to provide 4-dimensional measurements with high resolution in both space and time dimensions. AC-LGAD sensors designed and fabricated at the Brookhaven National Laboratory (USA) have been coupled to Timepix3, a pixel detector read-out chip for X-ray imaging and particle track reconstruction developed by the Medipix3 collaboration, offering pixel-level threshold adjustment on a 256x256 pixel matrix and high precision Time-of-Arrival and Time Over Threshold measurement of incoming particles. Three different AC-LGAD strip detectors, custom designed to fit the Timepix3 chip specifications, have been bonded onto a single Timepix3 chip. Studies of the electrical coupling of the two systems and the characterization of AC-LGAD signals readout by the Timepix3 chip are discussed in this work.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

10301 - Atomic, molecular and chemical physics (physics of atoms and molecules including collision, interaction with radiation, magnetic resonances, Mössbauer effect)

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2022

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

2022 IEEE Nuclear Science Symposium and Medical Imaging Conference (NSS/MIC)

ISBN

978-1-6654-8872-3

ISSN

2577-0829

e-ISSN

2577-0829

Počet stran výsledku

4

Strana od-do

—

Název nakladatele

IEEE (Institute of Electrical and Electronics Engineers)

Místo vydání

—

Místo konání akce

Milano

Datum konání akce

5. 11. 2022

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

—