Novel water based cutting fluids for saw technology

Kód výsledku v IS VaVaI

RIV/70883521:28110/10:63509272 - isvavai.cz

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Novel water based cutting fluids for saw technology

Popis výsledku v původním jazyce

Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC)in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System´s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning ofmodern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of th

Název v anglickém jazyce

Novel water based cutting fluids for saw technology

Popis výsledku anglicky

Our research was focused on development of novel water-soluble coolant for the multiwire saw slicing of silicon ingots by means of Advance Wire Saw Machine AWSM 3800.6 technology (KUKA S-Base). The coolant exhibited excellent dispersion of abrasive (SiC)in the system, was of high colloidal stability, had no odor, was non toxic for skin, had good biodegradability, exhibited very low foaming at high wire speeds as well as slurry flow rates, and had excellent cleaning capability by conventional technology. System´s high flexibility to vary by simple variables (e.g. abrasive concentration) the thickness of the cut wafers, thus control over all amount of residual cut material give it the high potential for application of eco-design approach in planning ofmodern mass wafer production lines. Based on the preliminary data from our tests produced wafers were of excellent surface quality (small surface roughness) and good thickness variations. Promising seems to be the ability of upscale of th

Druh

D - Stať ve sborníku

CEP obor

CF - Fyzikální chemie a teoretická chemie

OECD FORD obor

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Projekt

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Návaznosti

S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2010

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Proceedings of the 12 th Scientific and Business Conference SILICON 2010

ISBN

978-80-254-7361-0

ISSN

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e-ISSN

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Počet stran výsledku

8

Strana od-do

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Název nakladatele

TECON Scientific, spol. s r. o.

Místo vydání

Rožnov pod Radhoštěm

Místo konání akce

Rožnov pod Radhoštěm

Datum konání akce

1. 1. 2010

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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