Mathematical model of an integrated circuit cooling through cylindrical rods

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F17%3A63517238" target="_blank" >RIV/70883521:28140/17:63517238 - isvavai.cz</a>

Výsledek na webu

<a href="https://www.itm-conferences.org/articles/itmconf/pdf/2017/01/itmconf_amcse2017_01013.pdf" target="_blank" >https://www.itm-conferences.org/articles/itmconf/pdf/2017/01/itmconf_amcse2017_01013.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1051/itmconf/20170901013" target="_blank" >10.1051/itmconf/20170901013</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Mathematical model of an integrated circuit cooling through cylindrical rods

Popis výsledku v původním jazyce

One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton&apos;s law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface). This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.

Název v anglickém jazyce

Mathematical model of an integrated circuit cooling through cylindrical rods

Popis výsledku anglicky

One of the main challenges in integrated circuits development is to propose alternatives to handle the extreme heat generated by high frequency of electrons moving in a reduced space that cause overheating and reduce the lifespan of the device. The use of cooling fins offers an alternative to enhance the heat transfer using combined a conduction-convection systems. Mathematical model of such process is important for parametric design and also to gain information about temperature distribution along the surface of the transistor. In this paper, we aim to obtain the equations for heat transfer along the chip and the fin by performing energy balance and heat transfer by conduction from the chip to the rod, followed by dissipation to the surrounding by convection. Newton&apos;s law of cooling and Fourier law were used to obtain the equations that describe the profile temperature in the rod and the surface of the chip. Ordinary differential equations were obtained and the respective analytical solutions were derived after consideration of boundary conditions. The temperature along the rod decreased considerably from the initial temperature (in contatct with the chip surface). This indicates the benefit of using a cilindrical rod to distribute the heat generated in the chip.

Druh

D - Stať ve sborníku

CEP obor

—

OECD FORD obor

20303 - Thermodynamics

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

ITM Web of Conferences

ISBN

—

ISSN

2271-2097

e-ISSN

neuvedeno

Počet stran výsledku

4

Strana od-do

"nestrankovano"

Název nakladatele

EDP Sciences

Místo vydání

Les Ulis

Místo konání akce

Řím

Datum konání akce

5. 11. 2016

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

000402753800013