Performance Measurement of the D-Class Audio Amplifier

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28140%2F18%3A63520326" target="_blank" >RIV/70883521:28140/18:63520326 - isvavai.cz</a>

Výsledek na webu

<a href="http://www.daaam.info/Downloads/Pdfs/proceedings/proceedings_2018/038.pdf" target="_blank" >http://www.daaam.info/Downloads/Pdfs/proceedings/proceedings_2018/038.pdf</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.2507/29th.daaam.proceedings.038" target="_blank" >10.2507/29th.daaam.proceedings.038</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Performance Measurement of the D-Class Audio Amplifier

Popis výsledku v původním jazyce

Class-D audio amplifiers seem to be a perspective way of development of electronics as they can obtain excellent power efficiency together with good performance characteristics. Moreover, they can be easily integrated on a single chip, resulting in clear, comprehensive and non-reckless construction of the audio amplifier. Because the power efficiency is considerably high, some designs even do not need any heat sink, since the heat dissipation can be fully provided by the chip package. In this paper a construction of such an amplifier, being based on the integrated circuit TPA3122, is described. This construction has been developed at Tomas Bata University in Zlin, using conventional component base. Moreover, the paper provides a comparison of the measured performance of the amplifier to the theoretical values provided by the manufacturer of the chip.

Název v anglickém jazyce

Performance Measurement of the D-Class Audio Amplifier

Popis výsledku anglicky

Class-D audio amplifiers seem to be a perspective way of development of electronics as they can obtain excellent power efficiency together with good performance characteristics. Moreover, they can be easily integrated on a single chip, resulting in clear, comprehensive and non-reckless construction of the audio amplifier. Because the power efficiency is considerably high, some designs even do not need any heat sink, since the heat dissipation can be fully provided by the chip package. In this paper a construction of such an amplifier, being based on the integrated circuit TPA3122, is described. This construction has been developed at Tomas Bata University in Zlin, using conventional component base. Moreover, the paper provides a comparison of the measured performance of the amplifier to the theoretical values provided by the manufacturer of the chip.

Druh

D - Stať ve sborníku

CEP obor

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OECD FORD obor

10201 - Computer sciences, information science, bioinformathics (hardware development to be 2.2, social aspect to be 5.8)

Projekt

Výsledek vznikl pri realizaci vícero projektů. Více informací v záložce Projekty.

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2018

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název statě ve sborníku

Annals of DAAAM and Proceedings of the International DAAAM Symposium

ISBN

978-3-902734-20-4

ISSN

1726-9679

e-ISSN

neuvedeno

Počet stran výsledku

6

Strana od-do

0267-0272

Název nakladatele

DAAAM International Vienna

Místo vydání

Vienna

Místo konání akce

Zadar

Datum konání akce

24. 10. 2018

Typ akce podle státní příslušnosti

WRD - Celosvětová akce

Kód UT WoS článku

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