Influence of polyhedral oligomeric silsesquioxane particles on the thermomechanical behaviour of epoxy resin

Kód výsledku v IS VaVaI

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Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Influence of polyhedral oligomeric silsesquioxane particles on the thermomechanical behaviour of epoxy resin

Popis výsledku v původním jazyce

Epoxy resins are widely used in many industrial applications involving high-tech applications in aircraft and aerospace indsutry. In this field their oustanding mechanical properties play an important role. One of the limitation of epoxy resins as an adhesive system is their glass transition temperature, at which mechanical properties of epoxy resins strongly change. This study deals with influence of addition of polyhedral oligomeric silsesquioxane particles to epoxy resins and their effect on the thermomechanical behaviour of prepared composites. Properties of prepared systems were investigated using differential scanning analysis, thermomechanical analysis, and dynamic mechanical analysis. Composite thermosetic systems were prepared by mixing commercial epoxy resin, polyhedral oligomeric silsesquioxane particles and curing agent. Polyhedral oligomeric silsesquioxane particles were used at different loadng levels and their influence on the curing kinetics, glass transition temperature and thermomechanical properties of prepared systems was investigated. With increasing loading level of polyhedral oligomeric silsesquioxane particles the curing time of the samples slightly increased and the glass transition temperature significantly decreased. It was found that the presence of the particles do not affect the mechanical modulus under the glass transition temperature, however, significantly influence character of the transition and the value of the mechanical modulus over the glass transition temperature. While pure epoxy resin without polyhedral oligomeric silsesquioxane particles undergoes signifcant transition in mechanical behaviour around the glass transition temperature represented by the values of tan δ &gt; 1, with increasing loading level of the particles the values of the tan δ were significantly lower and further the values of the mechanical modulus over the glass transition temperature retain significantly higher when compared to pure resin. Thus, eventhough the use of polyhedral oligomeric silsesquioxane particles in epoxy resins led to decrease in glass transition temperature, the values of mechanical modulus over the glass transition temperature were found higher for the systems with polyhedral oligomeric silsesquioxane particles.

Název v anglickém jazyce

Influence of polyhedral oligomeric silsesquioxane particles on the thermomechanical behaviour of epoxy resin

Popis výsledku anglicky

Epoxy resins are widely used in many industrial applications involving high-tech applications in aircraft and aerospace indsutry. In this field their oustanding mechanical properties play an important role. One of the limitation of epoxy resins as an adhesive system is their glass transition temperature, at which mechanical properties of epoxy resins strongly change. This study deals with influence of addition of polyhedral oligomeric silsesquioxane particles to epoxy resins and their effect on the thermomechanical behaviour of prepared composites. Properties of prepared systems were investigated using differential scanning analysis, thermomechanical analysis, and dynamic mechanical analysis. Composite thermosetic systems were prepared by mixing commercial epoxy resin, polyhedral oligomeric silsesquioxane particles and curing agent. Polyhedral oligomeric silsesquioxane particles were used at different loadng levels and their influence on the curing kinetics, glass transition temperature and thermomechanical properties of prepared systems was investigated. With increasing loading level of polyhedral oligomeric silsesquioxane particles the curing time of the samples slightly increased and the glass transition temperature significantly decreased. It was found that the presence of the particles do not affect the mechanical modulus under the glass transition temperature, however, significantly influence character of the transition and the value of the mechanical modulus over the glass transition temperature. While pure epoxy resin without polyhedral oligomeric silsesquioxane particles undergoes signifcant transition in mechanical behaviour around the glass transition temperature represented by the values of tan δ &gt; 1, with increasing loading level of the particles the values of the tan δ were significantly lower and further the values of the mechanical modulus over the glass transition temperature retain significantly higher when compared to pure resin. Thus, eventhough the use of polyhedral oligomeric silsesquioxane particles in epoxy resins led to decrease in glass transition temperature, the values of mechanical modulus over the glass transition temperature were found higher for the systems with polyhedral oligomeric silsesquioxane particles.

Druh

O - Ostatní výsledky

CEP obor

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OECD FORD obor

10404 - Polymer science

Projekt

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Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2017

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů