Filtry
Influence of Intermetallic Compounds on RF Resistance of Joints Soldered with Lead Free Alloys
During soldering process intermetallic compounds as a reaction between solder and substrate are created. Physical properties of those compounds are different to properties of solder and substrate. The influence of inter...
JA - Elektronika a optoelektronika, elektrotechnika
- 2012 •
- Jx •
- Odkaz
Rok uplatnění
Jx - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
Výsledek na webu
Effect of multiple reflow cycles on intermetallic compound creation
This paper deals with the effect of the solder profile and multiple reflow cycles on intermetallic compound (IMC) creation. Soldered joints between PCB and 1206 soldering alloys. The thickness and composition of IMC
JA - Elektronika a optoelektronika, elektrotechnika
- 2015 •
- D •
- Odkaz
Rok uplatnění
D - Stať ve sborníku
Výsledek na webu
Formation and Growth of Intermetallic Compounds in Solder Joint
This article deals with intermetallic layers which occure at the interface between solder and soldered material. Formation and growth observing of intermetallic compounds (IMC) between various lead-free soldering a...
JA - Elektronika a optoelektronika, elektrotechnika
- 2011 •
- O
Rok uplatnění
O - Ostatní výsledky
Influence of Reflow Profile to Solder Joint Mechanical Strength
This paper investigates the effects of reflow time and reflow peak temperature on the mechanical strength and the intermetallic compound (IMC) thickness for Sn3.0Ag0.5Cu (SAC) soldered joints. The input variables are the pe...
JA - Elektronika a optoelektronika, elektrotechnika
- 2013 •
- O
Rok uplatnění
O - Ostatní výsledky
Influence of Intermetallic Compounds Growth on Properties of Lead-free Solder Joints
This article deals with the growth of intermetallic compounds (IMCs) in solder joints and influence of these IMCs on properties of soldered joints. The test for research of IMCs and their influence on prop...
JA - Elektronika a optoelektronika, elektrotechnika
- 2012 •
- D •
- Odkaz
Rok uplatnění
D - Stať ve sborníku
Výsledek na webu
Intermetallic compounds in lead-free solder joint
of intermetallic compounds in solder joints and the effect on its properties. Observations of intermetallic compounds creation between lead-free solders and solder materials is therefore of intermetallic ...
JA - Elektronika a optoelektronika, elektrotechnika
- 2011 •
- O
Rok uplatnění
O - Ostatní výsledky
Long-term Behavior of IMCs in Lead-free Solder Joints
This article deals with the creation and growth of intermetallic compounds (IMCs) in solder joints. The test samples of copper substrate were made chosen for research of IMCs. The test samples were divided into sev...
JA - Elektronika a optoelektronika, elektrotechnika
- 2011 •
- D •
- Odkaz
Rok uplatnění
D - Stať ve sborníku
Výsledek na webu
Intermetallic compounds at the interface between SnCu(Ni) solders and Cu substrate
used in this investigation to study the growth kinetics of the intermetallic compounds formed at the interface of the liquid Sn-Cu based solder and the Cu substrate and the kinetics of IMC growt....
BM - Fyzika pevných látek a magnetismus
- 2009 •
- Jx
Rok uplatnění
Jx - Nezařazeno - Článek v odborném periodiku (Jimp, Jsc a Jost)
Effect of thermal ageing on the growth of intermetallic layers in solder alloys
This paper is focused on the influence of intermetallic compound (IMC) growth. The experiment is presented five types of solder alloys which four types are a new combination of elements. Results are focused on the influence...
Electrical and electronic engineering
- 2022 •
- O
Rok uplatnění
O - Ostatní výsledky
Effect of thermal ageing on the growth of intermetallic layers in solder alloys
This paper is focused on the influence of intermetallic compound (IMC) growth. The experiment is presented five types of solder alloys which four types are a new combination of elements. Results are focused on the influence...
Electrical and electronic engineering
- 2022 •
- O
Rok uplatnění
O - Ostatní výsledky
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