Thermomechanical Modelling of Multisubstrate Modules
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F02%3APU29151" target="_blank" >RIV/00216305:26220/02:PU29151 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Thermomechanical Modelling of Multisubstrate Modules
Original language description
As today?s electronic assembly tries to reach low cost and very fast design-to-production process, the mathematical modelling of assembled devices is necessary. The electronic interconnection and package solution is also desirable to be modelled and improved during the design process without a need to produce many prototypes. This article focuses on the area of modelling stacked devices such as MSMs (Multisubstrate Module), discusses solders as interconnection materials and presents results from severall ANSYS analyses. One of the main purposes is a comparison of thermomechanical properties of MSMs when lead free solder and eutectic solder are used for the connection between ceramic and organic (FR4) substrates.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2002
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Electronic Devices and Systems 02 - Proceedings Experimental Methods in Acoustic and Electromagnetic Emission
ISBN
80-214-2180-0
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
230-233
Publisher name
Ing.Zdeněk Novotný, CSc., Brno
Place of publication
Brno
Event location
Brno
Event date
Sep 9, 2002
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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