NOISE AND NON-LINEARITY OF THICK-FILM RESISTORS
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F02%3APU30722" target="_blank" >RIV/00216305:26220/02:PU30722 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
NOISE AND NON-LINEARITY OF THICK-FILM RESISTORS
Original language description
The noise spectroscopy measurement and third harmonic testing of thick-film resistors is proposed as a diagnostic tool for the prediction of possible types of failure. The sources of fluctuations are both in the resistor volume and in contact region. There are two sources of noise and non-linearity in the resistor volume: the junctions between the metallic grains and glass layers and defects of the thick conducting layer structure. 1/f noise in low frequency range is given by two components: fundamentall 1/f noise, and excess 1/fa noise created by defects. Carrier transport in thick conducting layers is not strictly linear and third harmonic voltage is proportional to the third power of electric field intensity or current density. It was proved experimentally, that the noise spectral density is inversely proportional to the square of sample length, or electric field intensity. Screening of thick-film resistors by noise and non-linearity indicators selects samples, which are anomalous.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/ME%20244" target="_blank" >ME 244: Noise spectroscopy for quality and reliability asessment of thick film resistors</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2002
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of European Microelectronics packaging & interconection Symposium
ISBN
83-904462-8-6
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
320-323
Publisher name
IMAPS - Poland Chapter
Place of publication
Krakow, Poland
Event location
Cracow
Event date
Jun 16, 2002
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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