The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F10%3APU86819" target="_blank" >RIV/00216305:26220/10:PU86819 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
The Use Of Creep-Fatigue Models For Solder Joints Reliability Prediction
Original language description
The article treats creep-fatigue models used for lifetime estimate of solder joints. It also states the results of practical measurement (with the use of BGA parts) and the theoretical computation of the lifetime of solder joints soldered with lead-freesolder SAC 305. In order to obtain experimental data, the test sample is repeatedly exposed to temperatures ranging from -20 to +100 centigrade, with a dwell time of 15 minutes at maximum and minimum temperature. The experiment is still in progress. In this article, the experimental results of the research will be confronted with the theoretical computations
Czech name
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Czech description
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Project
<a href="/en/project/FR-TI1%2F072" target="_blank" >FR-TI1/072: Use of Modern Assembly Techniques and Materials in Electronic Industry</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
SECOND FORUM OF YOUNG RESEARCHERS In the framework of International Forum "Education Quality 2010"
ISBN
978-5-7526-0442-3
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
Publishing House of ISTU
Place of publication
Izhevsk, Russia
Event location
Izhevsk
Event date
Apr 21, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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