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Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU96942" target="_blank" >RIV/00216305:26220/11:PU96942 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints

  • Original language description

    The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printedcircuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assembl

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/FR-TI1%2F072" target="_blank" >FR-TI1/072: Use of Modern Assembly Techniques and Materials in Electronic Industry</a><br>

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    18th European microelectronics packaging conference EMPC 2011 - Proceedings

  • ISBN

    978-0-9568086-0-8

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    210-214

  • Publisher name

    Neuveden

  • Place of publication

    Brihton, UK

  • Event location

    Brighton

  • Event date

    Sep 12, 2011

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article