Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F11%3APU96942" target="_blank" >RIV/00216305:26220/11:PU96942 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Reliability Model for Assessment of Lifetime of Lead-Free Solder Joints
Original language description
The article deals with amalgamation of several methods with the aim to verify reliability of solder joints created with lead-free solder SAC 305. The total number of cycles to failure Nf of solder joints of the test assembly of printed circuit boards (PCB) was theoretically computed at the beginning of the experiment. In the next step, the number of cycles to failure of the solder joints of the test assembly was determined in the Ansys simulation system. A fatigue model based on creep deformation (Schubert et al.) was used for the computation. In order to define the marginal conditions more precisely during the whole duration of the experiment, the temperature on the solder joint was measured as well as the temperatures on the component and the printedcircuit board. The lifetime of the solder joints of test assembly was computed using the given fatigue model. To verify the results obtained by the fatigue model and computation method, an experiment was conducted, where the test assembl
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/FR-TI1%2F072" target="_blank" >FR-TI1/072: Use of Modern Assembly Techniques and Materials in Electronic Industry</a><br>
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
18th European microelectronics packaging conference EMPC 2011 - Proceedings
ISBN
978-0-9568086-0-8
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
210-214
Publisher name
Neuveden
Place of publication
Brihton, UK
Event location
Brighton
Event date
Sep 12, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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