TECHNOLOGICAL ASPECTS OF REWORK
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU113886" target="_blank" >RIV/00216305:26220/15:PU113886 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
TECHNOLOGICAL ASPECTS OF REWORK
Original language description
The paper deals with the technological aspects of rework. There are introduced some of these aspects as ambient temperature and ambient humidity, handling and storing devices and components, operators work, reflow soldering thermal profile, influence offlux. Technological aspects negatively influence reliability of soldering process, it is important to pay close attention to this phenomenon. They also have negative influence on repair yield.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 21st Conference STUDENT EEICT 2015
ISBN
978-80-214-5148-3
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
396-400
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních
Place of publication
Brno
Event location
Brno
Event date
Apr 23, 2015
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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