New Possible Way for Brazing of Thick Film Cermet Conductors
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F19%3APU133107" target="_blank" >RIV/00216305:26220/19:PU133107 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8810246" target="_blank" >https://ieeexplore.ieee.org/document/8810246</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810246" target="_blank" >10.1109/ISSE.2019.8810246</a>
Alternative languages
Result language
angličtina
Original language name
New Possible Way for Brazing of Thick Film Cermet Conductors
Original language description
The main aim of this work was to show a new approach in using brazing technology (hard soldering) on thick film conductors. Metallic leads and thick film conductors on alumina substrate were used to verify brazed joints. A flame and conductive heat transfer methods were used for brazing of three braze alloys such as Ag15CuP, Ag40Sn and Ag45CuZn. The tested pattern was made using silver (Ag) and silver-palladium (AgPd) thick film pastes on 96% Al2O3 substrate by screen printed technique and followed by firing process at temperature 850 °C. Nickel-silver and nickel-chromium-titanium leads were brazed on the thick film conductors with subsequent evaluation of the shear and the pull strength joints. The results of this work demonstrated very effective brazing technology on thick film conductors without usage of protective atmosphere or oven.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
42nd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-1874-1
ISSN
2161-2528
e-ISSN
—
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE
Place of publication
Neuveden
Event location
Wroclaw
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000027