The Analysis of Wire Bonding Reliability under Critical Operating Conditions

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU137009" target="_blank" >RIV/00216305:26220/20:PU137009 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9120937" target="_blank" >https://ieeexplore.ieee.org/document/9120937</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9120937" target="_blank" >10.1109/ISSE49702.2020.9120937</a>

Result language
angličtina
Original language name
The Analysis of Wire Bonding Reliability under Critical Operating Conditions
Original language description
This study deals with properties of the wire bond connection under critical operating conditions. Changes in electrical resistivity and mechanical strength of the connection were analyzed. In this case, critical conditions are high ambient temperature and a high current flowing through the wire bond. It was found that there is an insignificant change in electrical resistivity of a 17,5 μm and 25,4 μm thick golden wire that was welded on thick golden film layer. However, a significant change was found in mechanical strength. The idea of an experiment is based on an assumption that this effect depends on the structure of the bonding pad and structural change of the golden wire.
Czech name
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Czech description
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Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
43nd International Spring Seminar on Electronics Technology (ISSE).
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
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Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
Neuveden
Event location
Demänovská dolina
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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