Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F20%3APU137027" target="_blank" >RIV/00216305:26220/20:PU137027 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9121138" target="_blank" >https://ieeexplore.ieee.org/document/9121138</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121138" target="_blank" >10.1109/ISSE49702.2020.9121138</a>

Result language
angličtina
Original language name
Investigation of Metallographic Etchants Selectivity for Tin Solder Alloys
Original language description
The main aim of this work was to determine and summarize the applicability of etching solutions for the preparation of examined solder joint samples after metallographic cross-sections. Each etchant has different etching rate for every element and compound thereby highlighting various information about the solder joint inner structure. These findings were subsequently used to recommend the choice of a given solution for certain information about the properties of the inner structure of the SAC305 solder joint. Four types of solutions with strong acid were used. The results showed that all etchants could be used for interfacial intermetallic compounds. However, only Etchant A and Etchant D were the most suitable for comprehensive examination of the SAC305 solder ball inner structure.
Czech name
—
Czech description
—

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
—
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE
Place of publication
Neuveden
Event location
Demänovská dolina
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)