Development of a New Ceramic Package Design for Special Applications

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F26%3A0199361" target="_blank" >RIV/00216305:26220/26:0199361 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11120933" target="_blank" >http://dx.doi.org/10.1109/ISSE65583.2025.11120933</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11120933" target="_blank" >10.1109/ISSE65583.2025.11120933</a>

Result language
angličtina
Original language name
Development of a New Ceramic Package Design for Special Applications
Original language description
This paper deals with the creation of a custom sealed ceramic package. It also optimizes the process of its creation using a combination of glass solder and lead-free solder. Glass solder is used for joining multiple layers of alumina ceramic (Al2O3) to create a cavity for the die. Lead free solder is then used in combination with thick film printing to enclose the cavity while not exceeding the maximum temperature of the die. With proper process optimization this package is capable of being hermetically sealed.
Czech name
—
Czech description
—

Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20200 - Electrical engineering, Electronic engineering, Information engineering

Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
9798331512163
ISSN
—
e-ISSN
2161-2536
Number of pages
5
Pages from-to
—
Publisher name
IEEE Computer Society
Place of publication
Budapest
Event location
Budapešť, Maďarsko
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001585293500020

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