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Adhesion of a-SiC:H and a-SiOC:H films deposited on silicon wafers by PECVD

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26310%2F16%3APU122521" target="_blank" >RIV/00216305:26310/16:PU122521 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Adhesion of a-SiC:H and a-SiOC:H films deposited on silicon wafers by PECVD

  • Original language description

    Adhesion of thin film to the substrate is one of the most important properties in determining its application possibilities. Thin films of hydrogenated amorphous carbon-silicon (a-SiC:H) and hydrogenated amorphous carbon-silicon oxide (a-SiOC:H) alloys were deposited on silicon wafers from tetravinylsilane (TVS) monomer or its mixtures with argon or oxygen gases by plasma-enhanced chemical vapor deposition (PECVD). The silicon wafers were pretreated with argon or oxygen plasmas (10 sccm, 5.7 Pa, 5-200 W) using continuous wave for 10 min to clean the surface from adsorbed gases and reach reproducible adhesion of thin films. A total mass flow rate of 3.8 sccm was used for film deposition; the argon or oxygen fraction in gas mixture was set to 0.92. Pulsed plasma was employed to deposit thin films at an effective power ranging from 2 to 150 W. Three sets of thin films with a thickness of 0.1 μm were deposited from pure TVS, TVS/Ar, and TVS/O2 mixtures to be tested by scratch test using a conical (90o) di

  • Czech name

  • Czech description

Classification

  • Type

    O - Miscellaneous

  • CEP classification

    CF - Physical chemistry and theoretical chemistry

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/GA16-09161S" target="_blank" >GA16-09161S: Synthesis of multifunctional plasma polymers for polymer composites without interfaces</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2016

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů