Adhesion and mechanical properties of a-CSi:H and a-CSiO:H thin films prepared by PECVD

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26310%2F18%3APU131465" target="_blank" >RIV/00216305:26310/18:PU131465 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Adhesion and mechanical properties of a-CSi:H and a-CSiO:H thin films prepared by PECVD
Original language description
The adhesion of the thin film (prepared by e.g. PVD or CVD) to the substrate is one of the most important properties and crucial attribute in determining of the thin film applications. Thin films with controlled adhesion are essential as anti-scratch, barrier, transparent, wear-resistant and antireflective coatings for surface modified materials. The greatest potential of this research for industrial applications is in glass-fiber-reinforced polymer composites without sharp interfaces and protective coatings. In this study, hydrogenated amorphous silicon-carbon (a-CSi:H) and hydrogenated amorphous carbon-silicon oxide (a-CSiO:H) thin films were characterized in terms of adhesion to the silicon substrate. Silicon wafers were pretreated with argon plasma (5.7 Pa, 10 sccm, 5 W, 10 min) using continuous wave to reach reproducible thin film adhesion. Thin films were deposited by plasma-enhanced chemical vapor deposition (PECVD) using pure tetravinylsilane (TVS) monomer or TVS in a mixture with argon or oxy
Czech name
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Czech description
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Project
<a href="/en/project/GA16-09161S" target="_blank" >GA16-09161S: Synthesis of multifunctional plasma polymers for polymer composites without interfaces</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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