Improvement of plating adhesion on PhotoVia substrates

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F07%3A43900814" target="_blank" >RIV/49777513:23220/07:43900814 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.1109/ISSE.2007.4432848" target="_blank" >http://dx.doi.org/10.1109/ISSE.2007.4432848</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2007.4432848" target="_blank" >10.1109/ISSE.2007.4432848</a>

Result language

angličtina

Original language name

Improvement of plating adhesion on PhotoVia substrates

Original language description

This paper deals with the microvia substrates. Microvia substrates are high density multilayer printed circuits boards with the reduced diameter of interconnection vias. PhotoVia method was used for the creation of microvias by photolithography. For thismethod, the photoimageable dielectric materials have to be used. This report deals with special composite photodielectrics. Unlike the convention photosensitive dielectrics, these materials do not require any special surface treatment due to the adhesion improvement. Experiments with variable quantity of ceramic filler were executed. Roughness of dielectric surface and adhesion of conductive layer were measured.

Czech name

—

Czech description

—

Type

D - Article in proceedings

CEP classification

JI - Composite materials

OECD FORD branch

—

Project

—

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2007

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

ISSE 2007

ISBN

978-1-4244-1217-4

ISSN

—

e-ISSN

—

Number of pages

5

Pages from-to

203-207

Publisher name

Technical University

Place of publication

Cluj-Napoca

Event location

Cluj-Napoca

Event date

May 9, 2007

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

000255232500038