Defect Level Prediction for Newly Designed Printed Circuit Board Assemblies

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F09%3A00503180" target="_blank" >RIV/49777513:23220/09:00503180 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Defect Level Prediction for Newly Designed Printed Circuit Board Assemblies
Original language description
In this paper a new defect level prediction tool is presented, which is intended for newly designed printed circuit board assemblies, especially for the PCBAs (Printed Circuit Board Assembly) determined for automotive industry. The tool is programmed inVisual Basic for Application (VBA) and can be operated in MS Excel environment. On the one hand, the defect level prediction tool results from the parts stress analysis prediction technique, but on the other, it results also from a defect level prediction model of PCBA manufacturing processes, which was created on the basis of empirical data coming from automotive electronics industry. The tool provides a prognosis in defects per million parts produced (dpm), which PCBA will reach in the field (field quality) and at delivery (delivery quality). A significant advantage of this tool lies in its feature, which allows the user to change test parameters and processes in order to fulfil customer requirements. The tool also provides a possibil
Czech name
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Czech description
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Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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